Datasheet

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POWER DRIVER FOR STEPPER MOTORS INTEGRATED CIRCUITS

TRINAMIC Motion Control GmbH & Co. KG

Hamburg, Germany

TMC6200 DATASHEET

FEATURES AND BENEFITS

3-phase motors up to 100A coil current (external MOSFETs)

Voltage Range 8 … 60V DC

Gate Drive Programmable 0.5A / 1A / 1.5A

Full Protection and Diagnostics via SPI interface

3 Floating Sense Amplifiers with programmable gain (5, 10, 20)

Gate Off Drive with 1Ω (LS) / 1.3Ω (HS) safe hold off resistance

SPI & Stand-Alone operation

Charge Pump for 100% Duty Cycle operation

Optional BBM break-before-make logic for single line control

Programmable Short and Overload current threshold and retry

Programmable Control Interface with 3 line or 6 line drive

Full Protection & Diagnostics

Compact Size 9x9mm

TQFP48 package

Double Pin Distance for safe operation at high voltage

APPLICATIONS

PMSM FOC drives and BLDC motors

Industrial Drives

Factory Automation

Lab Automation

Robotics

CNC machines

Textile Machines

Pumps

Surveillance Cameras

Home Automation

Printers

DESCRIPTION

The TMC6200 is a high-power gate-driver

for PMSM servo or BLDC motors. Using

six external MOSFETs and two or three

sense resistors, it integrates the full high

voltage part of a PMSM drive system for

12V, 24V or 48V, including in-line current

sense amplifiers with programmable

amplification. It can drive a wide range

of motors from Watt to Kilowatt.

Software controlled drive strength allows

in-system EME optimization. Programm-

able safety features like short detection

and overtemperature thresholds together

with an SPI interface for diagnostics

allow robust and reliable designs. With

the TMC6200, a minimum number of

external components is required to build

a rugged drive with full protection and

diagnostics.

Universal high voltage BLDC/PMSM/Servo MOSFET 3-halfbridge gate-driver with in line motor current

sensing. External MOSFETs for up to 100A motor current.

BLOCK DIAGRAM

Summary of content (47 pages)

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POWER DRIVER FOR STEPPER MOTORS INTEGRATED CIRCUITS TMC6200 DATASHEET Universal high voltage BLDC/PMSM/Servo MOSFET 3-halfbridge gate-driver with in line motor current sensing. External MOSFETs for up to 100A motor current.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 2 APPLICATION EXAMPLES: PMSM AND BLDC MOTORS The TMC6200 scores with integration of the complete high-voltage part for FOC controlled PMSM drivers. On the control side, it mates with sophisticated FOC TMC467x and TMC867x family controller chips, or with any microcontroller. Its versatile interface matches simple BLDC drives with minimum requirements on the µC PWM, as well as advanced PMSM control algorithms.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 3 Table of Contents 1 1.1 2 GENERAL CONFIGURATION REGISTERS ..........22 CURRENT SENSE AMPLIFIERS .....................27 6.1 6.2 6.3 7 SPI DATAGRAM STRUCTURE .........................18 SPI SIGNALS ................................................19 TIMING .........................................................20 REGISTER MAPPING .......................................21 5.1 6 STANDARD APPLICATION CIRCUIT ................
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 1 4 Principles of Operation The TMC6200 is a MOSFET gate driver for three phase PMSM and BLDC motors. Ideally suited for applications in the range of 12V to 48V, it supports motor power ratings from 1 Watt to 1kW. It complements with TRINAMICs TMC467x & TMC867x families of three phase motor controller ICs. Internal break-before-make timing is provided for the ease-of-use in combination with simple microcontrollers for PWM generation.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 5 +VM 100n 16V 100n VS VCP CE VSA VCP Gate Voltage Regulator 12VOUT 100n Charge Pump HS 5VOUT 5V Regulator IW USENSE + VCC_IO OTP memory UL pd VH pd VL pd WH pd WL pd B.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 6 1.1 Control Interfaces The TMC6200 supports six control lines for the MOSFET drivers. High-side and low-side outputs can be individually controlled, or by an individual enable pin plus polarity pin, using internal BBM circuitry. An SPI interface or standalone configuration is supported. 1.1.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 2 7 Pin Assignments CU W HSW 38 37 VSENSE 41 WSENSE V 42 39 HSV 43 40 CV USENSE 46 44 U 47 45 HSU 48 2.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) Pin LSU TQFP 5 Type 12VOUT 6 5VOUT 7 GNDA CURU CURV CURW 8 9 10 11 AO AO AO VOFS/TEST 12 AI CSN_IDRV0 13 DI SCK_IDRV1 14 DI SDI_AMPLx10 15 DI SDO_SINGLE 16 DIO UH 17 UL 18 VCC_IO 19 DI (pd) DI (pd) DI (pd) DI (pd) DI (pd) DI (pd) VH 20 VL 21 WH 22 WL 23 CLK 24 DI SPE 25 DI (pd) FAULT 26 DO DRV_EN 27 DI VSA 29 CPO 30 www.trinamic.com 8 Function Low side gate driver output. Output of internal 11.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) Pin TQFP Type CPI 32 VS 33 VCP 34 CW 36 HSW 37 W 38 WSENSE 39 AI VSENSE 41 AI V 42 HSV 43 CV 44 USENSE 46 U 47 HSU 48 Exposed die pad - AI Function Charge pump capacitor input. Tie to CPO using 22nF 100V capacitor. In case ringing of the power supply leads to considerable supply ripple, add a 10-22Ohm series resistor. Motor supply voltage. Provide filtering capacity near pin with short loop to GND plane.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 3 10 Sample Circuits The following sample circuits show the required external components in different operation and supply modes. The connection of the bus interface and further digital signals are left out for clarity. 3.1 Standard Application Circuit +VM Optional use lower voltage down to 12V 100n VS VSA Gate Voltage Regulator 12VOUT 100n CE VCP Charge Pump HS 5VOUT 5V Regulator IW RG USENSE + VCC_IO HSU U VOFS 2.2µ 3.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 11 Attention In case VSA is supplied by a different voltage source, make sure that VSA does not drop out during motor operation. The motor driver should be disabled in case VSA becomes switched off before VS. Hard switching edges on VSA might result in bridge cross-conduction otherwise. It is safest to derive VSA voltage from VS supply. Attention Make sure, that VCC_IO does not drop out during operation of the motor.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 12 3.3 Zero Standby Current Battery powered applications often require low current standby, while keeping the supply switched on. The TMC6200 can support these applications by completely powering down the control side, VSA, and with this also the charge pump and 5V supply. See Figure 3.3 for an example using a P-MOSFET as high-side switch. Gate charge / discharge is limited to avoid too steep slopes and excess current.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 13 3.4 MOSFETs and Slope Control The selection of power MOSFETs depends on a number of factors, like package size, on-resistance, voltage rating and supplier. It is not true, that larger, lower RDSon MOSFETs will always be better, as a larger device also has higher capacitances and may add more ringing in trace inductance and power dissipation in the gate drive circuitry.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 14 V12VOUT Miller plateau Lx MOSFET drivers 0V VVM Output slope BMx 0V Output slope -1.2V VVM+V12VOUT VVM Hx 0V VCX-VBMx HxBMx Miller plateau 0V tBBM tBBM tBBM Effective break-before-make time Load pulling BMx down Load pulling BMx up Figure 3.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 15 3.5 Tuning the MOSFET Bridge A clean switching event is favorable to ensure low power dissipation and good EMC behavior. Unsuitable layout or components endanger stable operation of the circuit. Therefore, it is important to understand the effect of parasitic trace inductivity and MOSFET reverse recovery.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 16 ENSURE RELIABLE OPERATION - Use SMD MOSFETs and short interconnections Provide sufficient power filtering capacity close to the bridge and close to VS pin Tune MOSFET switching slopes (measure switch-on event at MOSFET gate) to be slower than the MOSFET bulk diode reverse recovery time. This will reduce cross conduction.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 17 BRIDGE OPTIMIZATION EXAMPLE A driver for 15A, 60V has been designed using the MOSFET BSC037N08NS (3.7mΩ, 80V, QG=56nC, tRR=41ns) in the standard schematic. The MOSFETs offer roughly 20ns slope time at the lowest driver strength setting. Switching quality is good and signals are clean (Figure 3.7, ff.). At double drive strength, the slope time halves, and switching events still are clean.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 4 18 SPI Interface 4.1 SPI Datagram Structure The TMC6200 uses 40 bit SPI™ (Serial Peripheral Interface, SPI is Trademark of Motorola) datagrams for communication with a microcontroller. Microcontrollers which are equipped with hardware SPI are typically able to communicate using integer multiples of 8 bit. The NCS line of the device must be handled in a way, that it stays active (low) for the complete duration of the datagram transmission.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 4.1.2 19 Data Alignment All data are right aligned. Some registers represent unsigned (positive) values, some represent integer values (signed) as two’s complement numbers, single bits or groups of bits are represented as single bits respectively as integer groups. 4.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 20 4.3 Timing The SPI interface is synchronized to the internal system clock, which limits the SPI bus clock SCK to 1/4 of the system clock frequency. If the system clock is based on the on-chip oscillator, an additional 10% safety margin must be used to ensure reliable data transmission. All SPI inputs as well as the ENN input are internally filtered to avoid triggering on pulses shorter than 20ns. Figure 4.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 5 21 Register Mapping This chapter gives an overview of the complete register set. Some of the registers bundling a number of single bits are detailed in extra tables. The functional practical application of the settings is detailed in dedicated chapters. Note - All registers become reset to 0 upon power up, unless otherwise noted.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 22 5.1 General Configuration Registers GENERAL CONFIGURATION REGISTERS (0X00…0X0F) R/W Addr n RW 0x00 17 R+ WC 0x01 15 www.trinamic.com Register GCONF GSTAT Description / bit names Bit GCONF – Global configuration flags 0 disable: Driver Disable 1: Disable driver (e.g.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 23 GENERAL CONFIGURATION REGISTERS (0X00…0X0F) R/W Addr n Register Description / bit names The driver is disabled during undervoltage. This flag is latched for information. ORed to STATUS output. 4 shortdet_u 1: U short counter has triggered at least once. ORed to STATUS output. 5 s2gu 1: Short to GND detected on phase U. The driver becomes disabled until flag becomes cleared. ORed to STATUS output. 6 s2vsu 1: Short to VS detected on phase U.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 24 GENERAL CONFIGURATION REGISTERS (0X00…0X0F) R/W Addr n Register Description / bit names 11 OT150°C 31.. 24 Bit 2..0 W 0x06 OTP_PROG 5..4 15..8 Bit R 0x07 OTP_READ 7..0 4..0 RW 0x08 5 FACTORY_ CONF Bit 3..0 11..8 RW 0x09 19 SHORT_ CONF 17..16 20 www.trinamic.com VERSION: 0x10=first version of the IC Identical numbers mean full digital compatibility.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 25 GENERAL CONFIGURATION REGISTERS (0X00…0X0F) R/W Addr n Register Description / bit names 25..24 RETRY: Number of retries for short detection 0: Half bridge disabled after first short detection 1..3: Half bridge re-enabled in next chopper cycles 1 time to 3 times. With retry, the short-counter is decreased once each 256 chopper cycles per coil, unless the upper limit has been reached.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 5.1.1 26 OTP_READ – OTP configuration memory The OTP memory holds power up defaults for certain registers. All OTP memory bits are cleared to 0 by default. Programming only can set bits, clearing bits is not possible. Factory tuning of the clock frequency affects otp0.0 to otp0.4. The state of these bits therefore may differ between individual ICs. 0X05: OTP_READ – OTP MEMORY MAP Bit 7 Name otp0.7 6 otp0.6 5 otp0.5 otp_S2_LEVEL 4 3 2 1 0 otp0.4 otp0.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 6 27 Current Sense Amplifiers Integrated current sense amplifiers allow closed loop current regulation, as required for FOC control. Measurement in series with the coil by principle is optimum for signal availability, because the current will always pass the measurement shunt, independent of the actual chopper duty cycle and independent of chopper phase.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 28 settling time can result from increased length of motor cables and capacitive load on the cables, or parasitic inductivity of the sense resistors. Figure 6.2 Amplifier Settling after coil switch event (Green: Coil output, Yellow: Amplifier output) Figure 6.3 Output correctly sampled with sine wave current and 1.66V offset Attention Each switching event on one of the motor outputs will cause a spike on the related current measurement amplifier output.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 29 the resulting value as zero-reference. When changing amplification in the application, scale the offset measured with a different amplification accordingly. 6.2.2 Thermal Drift Further, the offset has a random certain thermal drift. Figure 6.5 shows an example. Thermal drift especially concerns applications, where the IC heats up significantly during operation.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 30 Figure 6.5 Example for Thermal Offset Drift at output (5x amplification) [mV] from 30°C to 120°C Attention The current amplifiers show a random offset. It has to be compensated individually for each channel in order to yield the absolute current. An initial compensation (after power-up) will basically eliminate most of this offset. Further, the current amplifiers show a random thermal drift.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 31 6.3 Choice of Sense Resistors Choose sense resistors with regard to the maximum motor current desired. Be sure to provide sufficient headroom for your current regulation loop in order to operate the motor at short time peak currents. A regulation loop always needs a headroom of 25% to 50%. The following table shows a choice of standard resistors (partially yielded by paralleling two resistors) and the peak currents which can safely be measured with 1.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 7 32 Diagnostics and Protection The TMC6200 supplies a complete set of diagnostic and protection capabilities, like short circuit protection and undervoltage detection. See the DRV_STATUS table for details. 7.
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TMC6200 DATASHEET (Rev. 1.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 8 34 External Reset The chip is loaded with default values during power on via its internal power-on reset. In order to reset the chip to power on defaults, any of the supply voltages monitored by internal reset circuitry (VSA, +5VOUT or VCC_IO) must be cycled. As +5VOUT is the output of the internal voltage regulator, it cannot be cycled via an external source except by cycling VSA.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 35 10 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances. Operating the circuit at or near more than one maximum rating at a time for extended periods shall be avoided by application design.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 36 11.2 DC and Timing Characteristics DC characteristics contain the spread of values guaranteed within the specified supply voltage range unless otherwise specified. Typical values represent the average value of all parts measured at +25°C. Temperature variation also causes stray to some values. A device with typical values will not leave Min/Max range within the full temperature range. Power Supply Current DC-Characteristics VVS = VVSA = 24.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 37 Charge Pump DC-Characteristics Parameter Charge pump output voltage Symbol VVCP-VVS Charge pump voltage threshold for undervoltage detection Charge pump frequency VVCP-VVS Linear Regulator DC-Characteristics fCP Conditions operating Min Typ V12VOUT - V12VOUT 2 1 rising, using internal 4.5 5.5 5V regulator voltage 1/32 fCLKOSC Max Unit V 6.5 V VVS = VVSA = 24.0V Parameter Symbol Conditions Min Typ Max Unit 4.80 5.0 5.
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TMC6200 DATASHEET (Rev. 1.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) Sense Amplifiers Parameter Duration of Disturbance on sense amplifier output after switching event / settling time Amplification Current amplifier differential input voltage range with VOFS=2.5V Current amplifier differential input voltage range with VOFS=1.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) Digital pins Parameter 40 DC-Characteristics Symbol Input voltage low level Input voltage high level Input Schmitt trigger hysteresis VINLO VINHI VINHYST Output voltage low level Output voltage high level Input leakage current Pullup / pull-down resistors Digital pin capacitance VOUTLO VOUTHI IILEAK RPU/RPD C Conditions Min Typ -0.3 0.7 VVIO Max 0.3 VVIO VVIO+0.3 V V V 0.2 V V µA kΩ pF 0.12 VVIO IOUTLO = 2mA IOUTHI = -2mA VVIO-0.2 -10 132 166 3.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 41 12 Layout Considerations 12.1 Exposed Die Pad The TMC6200 uses its die attach pad to dissipate heat from the gate drivers and the linear regulator to the board. For best electrical and thermal performance, use a reasonable amount of solid, thermally conducting vias between the die attach pad and the ground plane. The printed circuit board should have a solid ground plane spreading heat into the board and providing for a stable GND reference. 12.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 42 12.5 Layout Example Schematic extract of TMC6200-EVAL (TMC6200+MOSFETs shown) 1- Top Layer (assembly side) www.trinamic.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 3- Inner Layer (supply VS) 43 4- Bottom Layer Components Figure 12.1 Layout example Please refer www.trinamic.com for complete schematic and layout data of the evaluation board. www.trinamic.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 13 Package Mechanical Data 13.1 Dimensional Drawings TQFP48-EP Attention: Drawings not to scale. Figure 13.1 Dimensional drawings TQFP48-EP www.trinamic.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) Parameter total thickness stand off mold thickness lead width (plating) lead width lead frame thickness (plating) lead frame thickness body size X (over pins) body size Y (over pins) body size X body size Y lead pitch lead footprint exposed die pad size X exposed die pad size Y package edge tolerance lead edge tolerance coplanarity lead offset mold flatness Ref A A1 A2 b b1 c Min 0.05 0.95 0.17 0.17 0.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 46 14 Disclaimer TRINAMIC Motion Control GmbH & Co. KG does not authorize or warrant any of its products for use in life support systems, without the specific written consent of TRINAMIC Motion Control GmbH & Co. KG. Life support systems are equipment intended to support or sustain life, and whose failure to perform, when properly used in accordance with instructions provided, can be reasonably expected to result in personal injury or death.
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TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 47 16 Table of Figures FIGURE 1.1 STANDALONE APPLICATION USING DIFFERENTIAL SENSING....................................................................................... 4 FIGURE 1.2 STANDALONE APPLICATION USING SINGLE SHUNT CURRENT SENSING ....................................................................... 5 FIGURE 1.3 SPI MODE CONFIGURATION ....................................................................................................................