Specifications

TRUEBEYOND

4.5

Soldering

Recommendations

The RN4871-TR100 Bluetooth module is assembled using standard

lead-free reflow profile IPC/JEDEC J-STD-020.

The module can be soldered to the host PCB using standard leaded and

lead-free solder reflow profiles.

To avoid damaging the module, the following recommendations are

given:

• Microchip Technology Application Note, “AN233 Solder Reflow

Recommendation” (DS00233)

provides solder reflow recommendations

• Do not exceed peak temperature (TP) of 250°C

• Refer to the solder paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under the shield

• Use only one flow. If the PCB requires multiple flows,

apply the module on the final flow.

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