User's Manual Part 2

11.2: GAP Commands Chapter 11: AT Commands Reference
31
Model Constraint
cB-OEMSPA311
cB-OEMSPA331
cB-OEMSPA312
cB-OEMSPA332
If more than 20 devices are found, then devices may be listed
several times.
Bond (AT*AGB=)
AT Command Description
AT*AGB=<bd_addr><CR> Performs a GAP bond procedure with another Blue-
tooth device.
During the bonding procedure the fixed PIN code is
used, see the Write_Fixed_PIN and Read_Fixed_PIN
commands. Note that to be able to perform bonding
the remote device must be in pairable mode.
Command
Parameters
Type Value
bd_addr Bd_Addr Bluetooth device address of the device to bond
with.
Responses Description
<CR><LF>OK<CR><LF> Successful response
<CR><LF>ERROR<CR><LF> Error message.
Model Constraint
cB-OEMSPA311
cB-OEMSPA331
cB-OEMSPA312
cB-OEMSPA332
Not supported. Bonding is automatic when connecting if either of
the sides enforces security. The link keys are stored in a FIFO of
size five.
Un_Bond (AT*AGUB=)
AT Command Description
AT*AGUB=<bd_addr><CR> This command un-bonds a previously bonded device.
Command
Parameters
Type Value
bd_addr Bd_Addr Bluetooth device address of the device subject to
un-bond.
Responses Description