User's Manual

u-blox
Copyright © 2014 u-blox AG Page 18 of 24
5.2 PCB Solder Lands
5.2.1 Host Board
The host PCB footprint should not contain any traces or vias under the module except the pads connecting to the solder lands of connector
J4- and the 19 supplementary GND-pads. TP- and NC-pads are not mandatory but can be used to get a better balance of the solder
process.
5.2.2 Mounting Process
Although connectBlue devices will withstand two re-flow soldering processes (T < 250°C) we strongly recommend the modules not
max
being subjected to more than one soldering process after being shipped from connectBlue thus the modules are populated on the host
product in the final solder processing step.
The PCB in our modules is UL recognized ZPMV2 min. 130 °C flame class V-0 with ENIG coated solder lands.
The modules are produced in a lead-free process with a lead-free soldering paste.
It is recommended that the customers make their own electrical, climate, stress and vibration tests on the final assembled product
to secure that the manufacturing process hasn't damaged or affected the module in any way.
The modules are delivered in ESD bags (for small quantities) or tape-on-reel
Modules delivered on tape-on-reel are packaged in sealed drypack" bags, MSL-3
Modules delivered in ESD bag are not in a sealed drypack
The device recommended maximum re-flow temperature is 245°C for 10 sec.
The device absolute maximum re-flow temperature is 250°C for 3 sec.