Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11 Design-in Page 116 of 157
 Optimize antenna return loss, to optimize overall electrical performance of the module including a
decrease of module thermal power.
 Optimize the thermal design of any high-power components included in the application, such as linear
regulators and amplifiers, to optimize overall temperature distribution in the application.
 Select the material, the thickness and the surface of the box (i.e. the mechanical enclosure) of the
application device that integrates the module so that it provides good thermal dissipation.
Beside the reduction of the Module-to-Ambient thermal resistance implemented by correct application
hardware design, the increase of module temperature can be moderated by a correspondingly correct
application software implementation:
 Enable power saving configuration using the AT+CPSMS command
 Enable module connected mode for a given time period and then disable it for a time period long
enough to adequately mitigate the temperature increase.
2.13 Schematic for SARA-R4/N4 series module integration
2.13.1 Schematic for SARA-R4/N4 series modules
Figure 55 is an example of a schematic diagram where a SARA-R4/N4 series “00”, “01” or “x2” product
version is integrated into an application board using all available module interfaces and functions.