Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11 Handling and soldering Page 120 of 157
3 Handling and soldering
☞ No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.
3.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to SARA-R4/N4 series reels / tapes, Moisture Sensitivity levels (MSD), shipment
and storage information, as well as drying for preconditioning, see the SARA-R4/N4 series Data Sheet [1]
and the u-blox Package Information Guide [15].
3.2 Handling
The SARA-R4/N4 series modules are Electro-Static Discharge (ESD) sensitive devices.
⚠ Ensure ESD precautions are implemented during handling of the module.
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects
at different electrical potentials caused by direct contact or induced by an electrostatic field. The term is
usually used in the electronics and other industries to describe momentary unwanted currents that may
cause damage to electronic equipment.
The ESD sensitivity for each pin of SARA-R4/N4 series modules (as Human Body Model according to JESD22-
A114F) is specified in the SARA-R4/N4 series Data Sheet [1].
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small
working station or a large manufacturing area. The main principle of an EPA is that there are no highly
charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are
grounded, and charge build-up on ESD sensitive electronics is prevented. International standards are used
to define typical EPA and can be obtained for example from the International Electrotechnical Commission
(IEC) or the American National Standards Institute (ANSI).
In addition to standard ESD safety practices, the following measures should be taken into account whenever
handling the SARA-R4/N4 series modules:
 Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then
the first point of contact when handling the PCB must always be between the local GND and PCB GND.
 Before mounting an antenna patch, connect the ground of the device.
 When handling the module, do not come into contact with any charged capacitors and be careful when
contacting materials that can develop charges (e.g. patch antenna, coax cable, soldering iron).