Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11 Handling and soldering Page 122 of 157
3.3 Soldering
3.3.1 Soldering paste
"No Clean" soldering paste is strongly recommended for SARA-R4/N4 series modules, as it does not require
cleaning after the soldering process has taken place. The paste listed in the example below meets these
criteria.
Soldering Paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: 95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)
95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper)
Melting Temperature: 217 °C
Stencil Thickness: 150 µm for base boards
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.11.
☞ The quality of the solder joints should meet the appropriate IPC specification.
3.3.2 Reflow soldering
A convection type-soldering oven is strongly recommended for SARA-R4/N4 series modules over the
infrared type radiation oven. Convection heated ovens allow precise control of the temperature and all parts
will be heated up evenly, regardless of material properties, thickness of components and surface color.
Consider the ”IPC-7530A Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”.
Reflow profiles are to be selected according to the following recommendations.
⚠ Failure to observe these recommendations can result in severe damage to the device!
Preheat phase
Initial heating of component leads and balls. Residual humidity will be dried out. Note that this preheat
phase will not replace prior baking procedures.
 Temperature rise rate: max 3 °C/s If the temperature rise is too rapid in the preheat phase it may
cause excessive slumping.