Integration Manual

JODY-W3 series - System integration manual
UBX-19011209 - R07 Design-in Page 33 of 71
C2-Restricted
Figure 10 shows the pin layout for the JODY-W3 series module. The proposed land pattern layout
reflects the pin layout of the module. Both Solder Mask Defined (SMD) and Non Solder Mask Defined
(NSMD) pins can be used, however the following considerations apply:
• Pins 1 to 94 should be NSMD
• Inner pads must have a good thermal bonding to PCB ground planes to help spreading the heat
generated by the module.
• If NSMD design is chosen for inner pads, thermal reliefs should be considered and 4 or 9 vias per
pad must be added for heat sink. Those vias may require copper capping.
• If SMD design is chosen for inner pads, the land pattern can be flooded on a ground plane beneath
the module and vias added around the pads for heat sinking.
The suggested stencil layout for the JODY-W3 module is to follow the copper pad layout exactly as
described in Figure 10 for the outer pads, while the central pads should implement a special solder
paste pattern with the following characteristics:
• Solder paste area should be split in several smaller parts, typically four to nine depending on
copper pad area.
• Total solder paste area should cover about 50% to 60% of copper thermal pad area.
• Total solder paste area must not exceed 65% of copper thermal pad area.
Missing to consider solder paste optimization can lead to poor soldering quality in production.
A suggested stencil opening implementation is shown in Figure 11.
Figure 11: Stencil opening example for inner thermal pads (dimensions in µm)
⚠ The exact mask geometries, distances and stencil thicknesses must be adapted to the specific
production process of the customer.
2.8 Thermal guidelines
JODY-W3 series modules are designed to operate from -40 °C to +85 °C at an ambient temperature
inside the enclosure box. The board will generate heat during high loads that must be dissipated to
sustain the lifetime of the components.
The improvement of thermal dissipation in the module decreases its internal temperature and
consequently increases the long-term reliability of the device for applications operating at high
ambient temperatures.
For best performance, recommended layouts should follow the following guidelines:
• Vias specification for ground filling: , no thermal reliefs are allowed on vias.
Commented [m46]: Values need to be verified
Commented [LB47R46]: This is yet not available
Commented [CT48R46]: ROLLOVER to later
release?
Commented [MZ49R46]: ROLLOVER
Commented [CT50R46]: Have these values now
been validated?