Integration Manual

ManualsBrandsu-blox ManualsElectronicsJODY-W374-00A and JODY-W374-00B

JODY-W3 series - System integration manual

UBX-19011209 - R07 Design-in Page 34 of 71

C2-Restricted

• Ground vias density under the module: 



, thermal vias can be placed in gaps between

the thermal pads of the module.

• Minimum layer count and copper thickness: , .

• Minimum board size: .

• Power planes and signal traces should not cross the layers beneath the module to maximize heat

flow from the module.

Those recommendations allow the design to achieve a thermal characterization parameter of





 , where  refers to the “module’s junction to main PCB bottom side”.

The following additional hardware techniques can be used to improve the thermal performance of the

module in customer applications:

• Maximize the return loss of the antenna to reduce reflected RF power to the module.

• Improve the efficiency and the thermal design of any component that generates heat in the

application, including power supplies and processor, to spread the generated heat distribution

over the application device.

• Design the mechanical enclosure of the application device properly to provide ventilation and good

thermal dissipation.

• For continuous operation at high temperatures, high-power density applications, or reduced PCB

size, the designer can consider including a heat sink on main bottom side of the PCB. The heat sink

should be connected using electrically insulated / high thermal conductivity adhesive

2.9 ESD guidelines

JODY-W3 modules are manufactured through a highly automated process, which complies with

IEC61340-5-1 [6] (STM5.2-1999 Class M1 devices) standard. A manufacturing process on

customer’s manufacturing site that implements a basic ESD control program is considered sufficient

to guarantee the necessary precautions

for handling the modules. The ESD ratings of JODY-W3

module pins are stated in Table 23Table 24.

Applicability

Immunity level

All pins except ANTx

Human Body Model (HBM), ANSA/ESDA/JEDEC JS-001-2014

±1000 V

Charged Device Model (CDM), JESD22-C101.

±250 V

ANTx pins

Human Body Model (HBM), AEC-Q200-002 Rev B.

±1000 V

Charged Device Model (CDM), JESD22-C101.

±500V

Table 23: ESD immunity rating for pins of the JODY-W3 module

The designer must implement proper measures to protect from ESD events on any pin that may be

exposed to the end user in compliance with the following European regulations:

• ESD testing standard CENELEC EN 61000-4-2 [4]

• Radio equipment standard ETSI EN 301 489-1 [5]

• The minimum requirements as per these European regulations are summarized in Table 24Table

25.

Application