Integration Manual

JODY-W3 series - System integration manual
UBX-19011209 - R07 Handling and soldering Page 54 of 71
C2-Restricted
4.3 Reflow soldering process
JODY-W3 series modules are surface mounted devices supplied on a multi-layer FR4-type PCB with
gold-plated connection pads. The modules are produced in a lead-free process using lead-free
soldering paste. The thickness of solder resist between the host PCB top side and the bottom side of
JODY-W3 series modules must be considered for the soldering process.
JODY-W3 series modules are compatible with industrial reflow profile for RoHS solders, and “no-
clean soldering paste is strongly recommended.
JODY-W3 series modules comply to two reflow soldering cycles when mounted on a host
board. For further information, contact your local support team.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, the heat
transfer efficiency of the oven, and the type of solder paste that is used. The optimal soldering profile
must be trimmed for the specific process and PCB layout
The target values shown in Table 32 and Figure 16 are given as general guidelines for a Pb-free
process only. For further information, see also the JEDEC J-STD-020E [7] standard.
Process parameter
Unit
Target
Pre-heat
Ramp up rate to T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from 25°C)
s
150
t
S
(Pre-heat)
s
110
Peak
T
L
°C
217
t
L
(time above T
L
)
s
90
T
P
(absolute max)
°C
260
t
P
(time above T
P
-5°C)
s
30
Cooling
Ramp-down from T
L
K/s
6
General
T
to peak
s
300
Allowed soldering cycles
-
1
Table 32: Recommended reflow profile
Figure 16: Reflow profile
The lower value of T
P
and slower ramp down rate is preferred.
Commented [CT88]: Pins or pads?
Commented [CT89R88]: Confirmed by Cairong as
pads, Revisied
Commented [CT90]: Missing bow and twist
tolerances?
The bow and twist of the PCB is maximum
0.75% according to IPC-A-610E.”
Commented [CT91R90]: Cairong confirmed bow and
twist is not is not important in this context
Commented [CT92]: … for common SAC-type, RoHS
solders?
Commented [CT93R92]: Cairong confirmed “SAC-
type” unnecessary”
Commented [CT94]: Has 2-flow resoldering since
been approved for this module?
Commented [CT95R94]: Please check and confirm
status
Commented [LB96R94]: Two times reflow is
confirmed.
Upside down reflow is yet not verified.
Commented [LB97R94]:
Commented [CT98]: Ambiguous and confusing
What must be trimmed exactly and what “case”
does this refer to exactly?
Commented [CT99R98]: Revised