Integration Manual

JODY-W3 series - System integration manual
UBX-19011209 - R07 Handling and soldering Page 55 of 71
C2-Restricted
4.3.1 Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pins. Water will also
damage the sticker and the ink-jet printed text.
• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the housing, areas that are not accessible for post-wash inspections. The solvent will also damage
the sticker and the ink-jet printed text.
• Ultrasonic cleaning will permanently damage the module and the crystal oscillators in particular.
For best results use a "no clean" soldering paste and circumvent the need for a cleaning stage after
the soldering process.
4.3.2 Other notes
• Boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices may require wave soldering to solder the THT components. Only a single
wave soldering process is allowed for boards populated with the modules. Miniature Wave
Selective Solder process is preferred over traditional wave soldering process.
• Hand soldering is not recommended.
• Rework is not recommended.
• Conformal coating can affect the performance of the module, which means that it is important to
prevent the liquid from flowing into the module. The RF shields do not provide protection for the
module from coating liquids with low viscosity; therefore, care is required while applying the
coating. Conformal Coating of the module will void the warranty.
• Grounding metal covers: Attempts to improve grounding by soldering ground cables, wick, or other
forms of metal strips directly onto the EMI covers is done at the customer's own risk and voids the
module warranty. The numerous ground pins are adequate to provide optimal immunity to
interferences.
• The modules contain components which are sensitive to Ultrasonic Waves. Use of any Ultrasonic
Processes (cleaning, welding etc.) may damage the module. Use of ultrasonic processes during
the integration of the module into an end product will void the warranty.