User's Manual

LISA-U1/LISA-H1 series - System Integration Manual
3G.G2-HW-10002-2 Advance Information System description
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 Wireless baseband processor, a mixed signal ASIC which integrates:
 Microprocessor for controller functions, 2G & 3G upper layer software
 DSP core for 2G Layer 1 and audio processing
 3G coprocessor and HW accelerator for 3G Layer 1 control software and routines
 Dedicated HW for peripherals control, as UART, USB, SPI etc
 Memory system in a Multi-Chip Package (MCP) integrating two devices:
 NOR flash non-volatile memory
 DDR SRAM volatile memory
 Power Management Unit (PMU), used to derive all the system supply voltages from the module supply VCC
 32.768 kHz crystal, connected to the Real Time Clock (RTC) oscillator to provide the clock reference in idle or
power off mode
1.2.2 Hardware differences between LISA-U1/LISA-H1 series modules
Hardware differences between the LISA-U1/LISA-H1 series modules:
 3G Dual-band support:
 Band II (1900 MHz) and Band V (850 MHz) are supported by LISA-U100, LISA-U120, LISA-H100
 Band I (2100 MHz) and Band VIII (900 MHz) are supported by LISA-U110, LISA-U130, LISA-H110
 3G maximum data rate capabilities:
 HSUPA category 6, up to 7.2 Mb/s DL, 5.76 Mb/s UL for LISA-U1 series
 HSDPA category 8, up to 7.2 Mb/s DL, 384 kb/s UL for LISA-U1 series
 HSDPA category 6, up to 3.6 Mb/s DL, 384 kb/s UL for LISA-H1 series
 Audio support:
 One differential analog audio input, one differential analog audio output and one 4-wire digital audio
interface are supported by LISA-U120 and LISA-U130
 No analog audio input, no analog audio output and no digital audio interface are supported by
LISA-U100, LISA-U110, LISA-H100, LISA-H110