User's Manual

LISA-U1/LISA-H1 series - System Integration Manual
3G.G2-HW-10002-2 Advance Information Contents
Page 5 of 116
1.15.1 R&TTED and European Conformance CE mark ............................................................................ 79
1.15.2 IC ................................................................................................................................................ 79
1.15.3 Federal communications commission notice ................................................................................ 79
2 Design-In ..................................................................................................................... 82
2.1 Design-in checklist .............................................................................................................................. 82
2.1.1 Schematic checklist ..................................................................................................................... 82
2.1.2 Layout checklist ........................................................................................................................... 82
2.1.3 Antenna checklist ........................................................................................................................ 83
2.2 Design Guidelines for Layout .............................................................................................................. 84
2.2.1 Layout guidelines per pin function ............................................................................................... 84
2.2.2 Footprint and paste mask ............................................................................................................ 93
2.2.3 Placement ................................................................................................................................... 94
2.3 Thermal aspects .................................................................................................................................. 95
2.4 Antenna guidelines ............................................................................................................................. 96
2.4.1 Antenna termination ................................................................................................................... 97
2.4.2 Antenna radiation ....................................................................................................................... 98
2.4.3 Antenna detection functionality .................................................................................................. 99
2.5 ESD immunity test precautions ......................................................................................................... 102
2.5.1 General precautions .................................................................................................................. 102
2.5.2 Antenna interface precautions ................................................................................................... 103
2.5.3 Module interfaces precautions ................................................................................................... 104
3 Handling and soldering ........................................................................................... 105
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 105
3.2 Soldering .......................................................................................................................................... 105
3.2.1 Soldering paste.......................................................................................................................... 105
3.2.2 Reflow soldering ....................................................................................................................... 105
3.2.3 Optical inspection ...................................................................................................................... 107
3.2.4 Cleaning .................................................................................................................................... 107
3.2.5 Repeated reflow soldering ......................................................................................................... 107
3.2.6 Wave soldering.......................................................................................................................... 107
3.2.7 Hand soldering .......................................................................................................................... 107
3.2.8 Rework ...................................................................................................................................... 107
3.2.9 Conformal coating .................................................................................................................... 107
3.2.10 Casting ...................................................................................................................................... 108
3.2.11 Grounding metal covers ............................................................................................................ 108
3.2.12 Use of ultrasonic processes ........................................................................................................ 108
4 Product Testing......................................................................................................... 109
4.1 u-blox in-series production test ......................................................................................................... 109
4.2 Test parameters for OEM manufacturer ............................................................................................ 109
Appendix ........................................................................................................................ 110