Installation Instructions

LISA-U2 series - System Integration Manual
UBX-13001118 - R19 Early Production Information Design-In
Page 125 of 175
33.2 mm
5.25 mm
22.4 mm
5.3 mm 5.25 mm5.3 mm
1.3 mm
1.4 mm
1.0 mm
PIN 1
LISA-U2 bottom side
(through module view)
Exposed GND on LISA-U module bottom layer
Signals keep-out areas on application board
Figure 62: Signals keep-out areas on the top layer of the application board, below LISA-U2 series modules
2.2.3 Placement
Optimize placement for minimum length of RF line and closer path from DC source for VCC.
Make sure that RF and analog circuits are clearly separated from any other digital circuits on the system board.
Provide enough clearance between the module and any external part due to solder and paste masks design.
Milled edges that are present at module PCB corners, away from module pins metallization, can slightly increase
module dimensions from the width and the height described in the mechanical specifications sections of LISA-U2
series Data Sheet [1]: provide enough clearance between module PCB corners and any other external part
mounted on the application board.
The heat dissipation during continuous transmission at maximum power can significantly raise the
temperature of the application base-board below the LISA-U2 modules: avoid placing temperature
sensitive devices (e.g. GNSS receiver) close to the module.