Integration Manual

Table Of Contents
LISA-U2 series - System Integration Manual
UBX-13001118 - R25 System description Page 50 of 182
Follow these guidelines connecting the module to a SIM connector implementing SIM presence
detection:
Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module
Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module
Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module
Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module
Connect the UICC / SIM contact C5 (GND) to ground
Connect one pin of the mechanical switch integrated in the SIM connector (e.g. the SW2 pin as
described in Figure 23) to the GPIO5 input pin of the module
Connect the other pin of the mechanical switch integrated in the SIM connector (e.g. the SW1 pin
as described in Figure 23) to the V_INT 1.8 V supply output of the module by means of a strong
(e.g. 1 k) pull-up resistor, as the R1 resistor in Figure 23
Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in
Figure 23
Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM),
close to the specific pad of the SIM connector, to prevent digital noise
Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H330J) on each SIM
line (VSIM, SIM_CLK, SIM_IO, SIM_RST), very close to each specific pad of the SIM connector, to
prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the
SIM card holder
Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics
PESD0402-140) on each externally accessible SIM line, close to each specific pad of the SIM
connector: ESD sensitivity rating of the SIM interface pins is 1 kV (HBM as per JESD22-A114), so
that, according to the EMC/ESD requirements of the custom application, higher protection levels
can be required if the lines are externally accessible on the application device
Limit capacitance and series resistance on each SIM signal (SIM_CLK, SIM_IO, SIM_RST) to
match the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the
SIM_CLK line, 1.0 µ s is the maximum allowed rise time on the SIM_IO and SIM_RST lines)
LISA-U2 series
50
VSIM
48
SIM_IO
47
SIM_CLK
49
SIM_RST
4
V_INT
51
GPIO5
SIM CARD
HOLDER
C
5
C
6
C
7
C
1
C
2
C
3
SIM Card
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
J1
C4
SW1
SW2
D1 D2 D3 D4 D5 D6
R2
R1
C
8
C
4
Figure 23: Application circuit for connection to a single removable SIM card, with SIM detection implemented
Reference
Description
Part Number - Manufacturer
C1, C2, C3, C4
33 pF Capacitor Ceramic COG 0402 5% 25 V
GRM1555C1H330JZ01 - Murata
C5
100 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C104KA01 - Murata
D1, D2, D3,
D4, D5, D6
Very Low Capacitance ESD Protection
PESD0402-140 - Tyco Electronics
R1
1 k Resistor 0402 5% 0.1 W
RC0402JR-071KL - Yageo Phycomp
R2
470 k Resistor 0402 5% 0.1 W
RC0402JR-07470KL- Yageo Phycomp
J1
SIM Card Holder
6 + 2 positions, with card presence switch
Various Manufacturers,
CCM03-3013LFT R102 - C&K Components
Table 24: Example of components for connection to a single removable SIM card, with SIM detection implemented