Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Power management
- 1.6 System functions
- 1.7 RF connection
- 1.8 (U)SIM interface
- 1.9 Serial communication
- 1.10 DDC (I2C) interface
- 1.11 Audio Interface
- 1.12 General Purpose Input/Output (GPIO)
- 1.13 Reserved pins (RSVD)
- 1.14 Schematic for LISA-U series module integration
- 1.15 Approvals
- 2 Design-In
- 2.1 Design-in checklist
- 2.2 Design Guidelines for Layout
- 2.2.1 Layout guidelines per pin function
- 2.2.2 Footprint and paste mask
- 2.2.3 Placement
- 2.3 Thermal aspects
- 2.4 Antenna guidelines
- 2.5 ESD precautions
- 3 Features description
- 4 Handling and soldering
- 5 Product Testing
- Appendix
- A Migration to LISA-U2 series wireless modules
- B Glossary
- Related documents
- Revision history
- Contact
LISA-U series - System Integration Manual
3G.G2-HW-10002-A3 Preliminary Contents
Page 5 of 160
1.15.1 R&TTED and European Conformance CE mark .......................................................................... 100
1.15.2 IC .............................................................................................................................................. 101
1.15.3 Federal communications commission notice .............................................................................. 101
1.15.4 a-tick AUS Certification ............................................................................................................. 103
2 Design-In ................................................................................................................... 104
2.1 Design-in checklist ............................................................................................................................ 104
2.1.1 Schematic checklist ................................................................................................................... 104
2.1.2 Layout checklist ......................................................................................................................... 105
2.1.3 Antenna checklist ...................................................................................................................... 105
2.2 Design Guidelines for Layout ............................................................................................................ 106
2.2.1 Layout guidelines per pin function ............................................................................................. 106
2.2.2 Footprint and paste mask .......................................................................................................... 116
2.2.3 Placement ................................................................................................................................. 118
2.3 Thermal aspects ................................................................................................................................ 119
2.4 Antenna guidelines ........................................................................................................................... 120
2.4.1 Antenna termination ................................................................................................................. 121
2.4.2 Antenna radiation ..................................................................................................................... 122
2.4.3 Antenna detection functionality ................................................................................................ 123
2.5 ESD precautions ................................................................................................................................ 126
2.5.1 ESD immunity test overview ...................................................................................................... 126
2.5.2 ESD immunity test of LISA-U series reference design.................................................................. 126
2.5.3 ESD application circuits .............................................................................................................. 128
3 Features description ................................................................................................. 131
3.1 Firmware (upgrade) Over AT (FOAT) ................................................................................................. 131
3.1.1 Overview ................................................................................................................................... 131
3.1.2 FOAT procedure ........................................................................................................................ 131
3.2 TCP/IP and UDP/IP ............................................................................................................................. 131
3.2.1 Multiple PDP contexts and sockets............................................................................................. 131
3.3 FTP and FTPS .................................................................................................................................... 132
3.4 HTTP and HTTPS ............................................................................................................................... 132
3.5 AssistNow clients and GPS integration .............................................................................................. 132
3.6 Jamming Detection ........................................................................................................................... 132
3.7 In-Band modem ................................................................................................................................ 133
3.8 Smart Temperature Management ..................................................................................................... 133
3.8.1 Smart Temperature Supervisor (STS) .......................................................................................... 134
3.8.2 Threshold Definitions ................................................................................................................. 136
3.9 Hybrid positioning and CellLocate ..................................................................................................... 136
3.9.1 Positioning through cellular information: CellLocate .................................................................. 136
3.9.2 Hybrid positioning ..................................................................................................................... 138
4 Handling and soldering ........................................................................................... 139
4.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 139
4.2 Soldering .......................................................................................................................................... 139