Product data

LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.5 — 24 June 2014 81 of 89
NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
17. Soldering
Fig 43. Reflow soldering for the LQFP100 package
SOT407-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP100 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx HyP1 P2 C
sot407-1
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
17.300 17.300 14.300 14.3000.500 0.560 0.2801.500 0.400 14.500 14.500 17.550 17.550