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Data Sheet

ManualsBrandsUnbranded ManualsAccelerometers, Gyros, GPS, & Compasses6DOF MPU-6050 Gyroscope and Accelerometer Module
41424344454647484950
MPU-6000/MPU-6050 Product Specification
Document Number: PS-MPU-6000A-00
Revision: 3.4
Release Date: 08/19/2013
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Package Gyro & Accel Axes ( ) Relative to PCB Axes ( ) with Orientation Errors (Θ and Φ)
MPU
-
6000
MPU
-
6050
Φ
Θ
X
Y
Z
The table below shows the cross-axis sensitivity as a percentage of the gyroscope or accelerometer’s
sensitivity for a given orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
(θ or Φ)
Cross-Axis Sensitivity
(sinθ or sinΦ)
0º
0%
0.5º
0.87%
1º
1.75%
The specifications for cross-axis sensitivity in Section 6.1 and Section 6.2 include the effect of the die
orientation error with respect to the package.
11.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The MPU-60X0 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handling
precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the
bath energy causes excessive drive motion through resonant frequency coupling.
11.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.