Data Sheet

MPU-6000/MPU-6050 Product Specification
Document Number: PS-MPU-6000A-00
Revision: 3.4
Release Date: 08/19/2013
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 Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-
sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture
sealed bags until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensure
that all workstations and personnel are properly grounded to prevent ESD.
11.4.8 Reflow Specification
Qualification Reflow: The MPU-60X0 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.
The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for
lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and a
table explaining the set-points are shown below:
Temperature [°C]
Time [Seconds]
SOLDER REFLOW PROFILE FOR QUALIFICATION
LEAD-FREE IR/CONVECTION
Preheat
60-120sec
T
smax
T
smin
T
Liquidus
T
Pmin
T
Pmax
Liquidus
60-120sec
10-30sec
T
ramp-up
( < 3 C/sec)
T
ramp-down
( < 4 C/sec)
T
room-Pmax
(< 480sec)
A
B
C
D
E
F
G
H
I