Data Sheet

AMC1100
SBAS562 –APRIL 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE AND ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over the operating ambient temperature range, unless otherwise noted.
VALUE UNIT
Supply voltage, VDD1 to GND1 or VDD2 to GND2 –0.5 to 6 V
Analog input voltage at VINP, VINN GND1 – 0.5 to VDD1 + 0.5 V
Input current to any pin except supply pins ±10 mA
Maximum junction temperature, T
J
Max +150 °C
Human body model (HBM)
±2500 V
Electrostatic discharge (ESD)
JEDEC standard 22, test method A114-C.01
ratings,
Charged device model (CDM)
all pins
±1000 V
JEDEC standard 22, test method C101
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC1100
THERMAL METRIC
(1)
DUB (SOP) UNITS
8 PINS
θ
JA
Junction-to-ambient thermal resistance 75.1
θ
JCtop
Junction-to-case (top) thermal resistance 61.6
θ
JB
Junction-to-board thermal resistance 39.8
°C/W
ψ
JT
Junction-to-top characterization parameter 27.2
ψ
JB
Junction-to-board characterization parameter 39.4
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): AMC1100