Data Sheet

5
CD4051B , CD4052B , CD4053B
www.ti.com SCHS047I –AUGUST 1998–REVISED SEPTEMBER 2017
Product Folder Links: CD4051B CD4052B CD4053B
Submit Documentation FeedbackCopyright © 1998–2017, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply Voltage V+ to V-, Voltages Referenced to V
SS
Terminal –0.5 20 V
DC Input Voltage –0.5 V
DD
+ 0.5 V
DC Input Current Any One Input –10 10 mA
T
JMAX1
Maximum junction temperature, ceramic package 175 °C
T
JMAX2
Maximum junction temperature, plastic package 150 °C
T
LMAX
Maximum lead temperature, SOIC - Lead Tips Only, Soldering 10s 265 °C
T
stg
Storage temperature –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
CD4051B in PDIP, CDIP, SOIC, SOP, TSSOP Packages
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
+3000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
+2000
CD4053B in PDIP, CDIP, SOP and TSSOP Packages
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
+2500
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
+1500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Temperature Range –55 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC
(1)
CD405xB
UNITE (PDIP) M (SOIC) NS (SOP)
PW
(TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 67 73 64 108 °C/W