Data Sheet

DRV8835
www.ti.com
SLVSB18D MARCH 2012REVISED JANUARY 2014
DUAL LOW VOLTAGE H-BRIDGE IC
Check for Samples: DRV8835
1
FEATURES
2
Dual-H-Bridge Motor Driver
APPLICATIONS
Capable of Driving Two DC Motors or One
Battery-Powered:
Stepper Motor
Cameras
Low MOSFET On-Resistance:
DSLR Lenses
HS + LS 305 mΩ
Consumer Products
1.5-A Maximum Drive Current Per H-Bridge
Toys
Bridges May Be Paralleled for 3-A Drive
Robotics
Current
Medical Devices
Separate Motor and Logic Supply Pins:
0-V to 11-V Motor-Operating Supply-Voltage
Range
2-V to 7-V Logic Supply-Voltage Range
Separate Logic and Motor Power Supply Pins
Flexible PWM or PHASE/ENABLE Interface
Low-Power Sleep Mode With 95-nA Maximum
Supply Current
Tiny 2-mm x 3-mm WSON Package
DESCRIPTION
The DRV8835 provides an integrated motor driver solution for cameras, consumer products, toys, and other low-
voltage or battery-powered motion control applications. The device has two H-bridge drivers, and can drive two
DC motors or one stepper motor, as well as other devices like solenoids. The output driver block for each
consists of N-channel power MOSFET’s configured as an H-bridge to drive the motor winding. An internal charge
pump generates needed gate drive voltages.
The DRV8835 can supply up to 1.5-A of output current per H-bridge. It operates on a motor power supply voltage
from 0 V to 11 V, and a device power supply voltage of 2 V to 7 V.
PHASE/ENABLE and IN/IN interfaces can be selected which are compatible with industry-standard devices.
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage
lockout and overtemperature.
The DRV8835 is packaged in a tiny 12-pin WSON package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).
ORDERING INFORMATION
(1)
ORDERABLE PART TOP-SIDE
PACKAGE
(2)
NUMBER MARKING
PowerPAD™ (WSON) - DSS Reel of 3000 DRV8835DSSR 835
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012–2014, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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