Datasheet

4-49
The wide angle emitter, HSDL-
4220, is compatible with the IrDA
SIR standard and can be used
with the HSDL-1000 integrated
SIR transceiver.
Absolute Maximum Ratings
Parameter Symbol Min Max Unit Reference
Peak Forward Current I
FPK
500 mA [2], Fig. 2b
Duty Factor = 20%
Pulse Width = 100 µs
Average Forward Current I
FAVG
100 mA [2]
DC Forward Current I
FDC
100 mA [1], Fig. 2a
Power Dissipation P
DISS
260 mW
Reverse Voltage (I
R
= 100 µA) V
R
5V
Transient Forward Current (10 µs Pulse) I
FTR
1.0 A [3]
Operating Temperature T
O
070°C
Storage Temperature T
S
-20 85 °C
LED Junction Temperature T
J
110 °C
Lead Soldering Temperature 260 for °C
[1.6 mm (0.063 in.) from body] 5 seconds
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current as specified in Figure 5.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and
the wire bonds.
Electrical Characteristics at 25°C
Parameter Symbol Min Typ Max Unit Condition Reference
Forward Voltage V
F
1.30 1.50 1.70 V I
FDC
= 50 mA Fig. 2a
1.40 1.67 1.85 I
FDC
= 100 mA
2.15 I
FPK
= 250 mA Fig. 2b
Forward Voltage ∆V/∆T -2.1 mV/°CI
FDC
= 50 mA Fig. 2c
Temperature Coefficient -2.1 I
FDC
= 100 mA
Series Resistance R
S
2.8 ohms I
FDC
= 100 mA
Diode Capacitance C
O
40 pF 0 V, 1 MHz
Reverse Voltage V
R
520 V I
R
= 100 µA
Thermal Resistance, Rθ
jp
110 °C/W
Junction to Pin
The package design of these
emitters is optimized for efficient
power dissipation. Copper
leadframes are used to obtain
better thermal performance than
the traditional steel leadframes.