Datasheet
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
(Note 6)
Supply Voltage
g
20V
Power Dissipation (Note 1) 500 mW
Differential Input Current (Note 2)
g
10 mA
Input Voltage (Note 3)
g
15V
Output Short-Circuit Duration Continuous
Operating Temperature Range
LM118
b
55
§
Cto
a
125
§
C
LM218
b
25
§
Cto
a
85
§
C
LM318 0
§
Cto
a
70
§
C
Storage Temperature Range
b
65
§
Cto
a
150
§
C
Lead Temperature (Soldering, 10 sec.)
Hermetic Package 300
§
C
Plastic Package 260
§
C
Soldering Information
Dual-In-Line Package
Soldering (10 sec.) 260
§
C
Small Outline Package
Vapor Phase (60 sec.) 215
§
C
Infrared (15 sec.) 220
§
C
See AN-450 ‘‘Surface Mounting Methods and Their Effect
on Product Reliability’’ for other methods of soldering sur-
face mount devices.
ESD Tolerance (Note 7) 2000V
Electrical Characteristics (Note 4)
Parameter Conditions
LM118/LM218 LM318
Units
Min Typ Max Min Typ Max
Input Offset Voltage T
A
e
25
§
C 2 4 4 10 mV
Input Offset Current T
A
e
25
§
C 6 50 30 200 nA
Input Bias Current T
A
e
25
§
C 120 250 150 500 nA
Input Resistance T
A
e
25
§
C 1 3 0.5 3 MX
Supply Current T
A
e
25
§
C 5 8 5 10 mA
Large Signal Voltage Gain T
A
e
25
§
C, V
S
e
g
15V
50 200 25 200 V/mV
V
OUT
e
g
10V, R
L
t
2kX
Slew Rate T
A
e
25
§
C, V
S
e
g
15V, A
V
e
1
50 70 50 70 V/ms
(Note 5)
Small Signal Bandwidth T
A
e
25
§
C, V
S
e
g
15V 15 15 MHz
Input Offset Voltage 6 15 mV
Input Offset Current 100 300 nA
Input Bias Current 500 750 nA
Supply Current T
A
e
125
§
C 4.5 7 mA
Large Signal Voltage Gain V
S
e
g
15V, V
OUT
e
g
10V
25 20 V/mV
R
L
t
2kX
Output Voltage Swing V
S
e
g
15V, R
L
e
2kX
g
12
g
13
g
12
g
13 V
Input Voltage Range V
S
e
g
15V
g
11.5
g
11.5 V
Common-Mode Rejection Ratio 80 100 70 100 dB
Supply Voltage Rejection Ratio 70 80 65 80 dB
Note 1: The maximum junction temperature of the LM118 is 150
§
C, the LM218 is 110
§
C, and the LM318 is 110
§
C. For operating at elevated temperatures, devices
in the H08 package must be derated based on a thermal resistance of 160
§
C/W, junction to ambient, or 20
§
C/W, junction to case. The thermal resistance of the
dual-in-line package is 100
§
C/W, junction to ambient.
Note 2: The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input voltage in excess of
1V is applied between the inputs unless some limiting resistance is used.
Note 3: For supply voltages less than
g
15V, the absolute maximum input voltage is equal to the supply voltage.
Note 4: These specifications apply for
g
5V
s
V
S
s
g
20V and
b
55
§
C
s
T
A
s
a
125
§
C (LM118),
b
25
§
C
s
T
A
s
a
85
§
C (LM218), and 0
§
C
s
T
A
s
a
70
§
C
(LM318). Also, power supplies must be bypassed with 0.1 mF disc capacitors.
Note 5: Slew rate is tested with V
S
e
g
15V. The LM118 is in a unity-gain non-inverting configuration. V
IN
is stepped from
b
7.5V to
a
7.5V and vice versa. The
slew rates between
b
5.0V and
a
5.0V and vice versa are tested and guaranteed to exceed 50V/ms.
Note 6: Refer to RETS118X for LM118H and LM118J military specifications.
Note 7: Human body model, 1.5 kX in series with 100 pF.
2