Datasheet

ManualsBrandsUnbranded ManualsHighPower-LEDsHighPower LED Red 52 lm 130 ° 3.5 V 1000 mA

PRODUCT FAMILY DATA SHEET

notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

CLD-DS18 REV 12

Cree

XLamp

XP-E LEDs

PRODUCT DESCRIPTION

The XLamp XP-E LED combines the

proven lighting-class performance

and reliability of the XLamp XR-E

LED in a package with 80% small-

er footprint. The XLamp XP-E LED

continues Cree’s history of innova-

tion in LEDs for lighting applications

with wide viewing angle, symmetri-

cal package, unlimited oor life and

electrically neutral thermal path.

Cree XLamp LEDs bring high per-

formance and quality of light to

a wide range of lighting applica-

tions, including color-changing,

portable and personal, outdoor,

indoor-directional, transportation,

stage and studio, commercial and

emergency-vehicle lighting.

FEATURES

• Available in white, outdoor

white, 80-CRI, 85-CRI and

90-CRI white, royal blue, blue,

green, amber, red & red-orange

• Maximum drive current: up

to 1 A

• Low thermal resistance: as low

as 9°C/W

• Maximum junction temperature:

150°C

• Wide viewing angle: 115°–130°

• Unlimited oor life at

≤ 30°C/85% RH

• Reow solderable - JEDEC J-

STD-020C compatible

• Electrically neutral thermal path

• RoHS- and REACH-compliant

• UL-recognized component

(E326295)

WWW. CREE.COM/XLAMP

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

TABLE OF CONTENTS

Flux Characteristics - White ........ 2

Flux Characteristics - Color ......... 3

Characteristics .......................... 5

Relative Spectral Power

Distribution............................... 6

Relative Flux vs. Junction Tempera-

ture ......................................... 7

Electrical Characteristics ............. 8

Thermal Design ......................... 9

Relative Flux vs. Current ...........10

Relative Flux vs. Current ...........11

Typical Spatial Distribution .........11

Reow Soldering Characteristics .12

Notes ......................................13

Mechanical Dimensions..............14

Tape and Reel ..........................15

Packaging ................................16

Summary of content (16 pages)

PAGE 1
® ® Cree XLamp XP-E LEDs PRODUCT DESCRIPTION The XLamp XP-E LED combines the proven lighting-class performance and reliability of the XLamp XR-E LED in a package with 80% smaller footprint. The XLamp XP-E LED continues Cree’s history of innovation in LEDs for lighting applications with wide viewing angle, symmetrical package, unlimited floor life and electrically neutral thermal path.
PAGE 2
XLAMP XP-E LEDS FLUX CHARACTERISTICS (TJ = 25°C) - WHITE The following table provides several base order codes for XLamp XP-E LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XP Family Binning and Labeling document. Color CCT Range Min.
PAGE 3
XLAMP XP-E LEDS FLUX CHARACTERISTICS (TJ = 25°C) - COLOR The following table provides several base order codes for XLamp XP-E LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XP Family Binning and Labeling document. Dominant Wavelength Range Min. Color Royal Blue Max.
PAGE 4
XLAMP XP-E LEDS FLUX CHARACTERISTICS (TJ = 25°C) - COLOR (CONTINUED) Dominant Wavelength Range Min. Color Group RedOrange Max. DWL (nm) O3 610 Group DWL (nm) O4 620 Dominant Wavelength Range Min. Color Group Red R2 Max. DWL (nm) 620 Group R3 DWL (nm) 630 Base Order Codes Min Luminous Flux (lm) @ 350 mA Order Code Group Flux (lm) N3 56.8 XPERDO-L1-0000-00501 N4 62.0 XPERDO-L1-0000-00601 P2 67.2 XPERDO-L1-0000-00701 P3 73.
PAGE 5
XLAMP XP-E LEDS CHARACTERISTICS Characteristics Unit Thermal Resistance, junction to solder point - white, royal blue, blue °C/W 9 Thermal Resistance, junction to solder point - green °C/W 15 Thermal Resistance, junction to solder point - amber, red, red-orange °C/W 10 Viewing Angle (FWHM) - white degrees 115 Viewing Angle (FWHM) - royal blue, blue, green, red, red-orange, amber degrees 130 Temperature coefficient of voltage - white mV/°C -4.
PAGE 6
XLAMP XP-E LEDS RELATIVE SPECTRAL POWER DISTRIBUTION Relative Radiant Power (%) Relative Spectral Power 100 80 5000K 10000K CCT 3700K 5000K CCT 2600K 3700K CCT 60 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) White Relative Radiant Power (%) (%) Relative Radiant Power XP Color Graph 1100 80 100 Blue 80 60 Green Royal Blue Blue 60 40 Amber RedOrange Red Amber Green 40 20 Red-Orange 20 0 Red 400 450 500 400 450 500 0 550 600 650 700 750 Wavelength (nm) 650 5
PAGE 7
XLAMP XP-E LEDS RELATIVE FLUX VS.
PAGE 8
Blue XLAMP XP-E LEDS ELECTRICAL CHARACTERISTICS (TJ = 25°C) 700 Forward Current (mA) 600 500 400 Red, Red Orange 300 200 100 0 Graph 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Forward Voltage (V) 1000 Forward Current Forward Current (mA)(mA) 900 1000 800 900 700 800 600 700 White, Royal Blue, Blue 500 600 White, Royal Green Blue, Blue 400 500 300 400 Green 200 300 100 200 0 100 Graph 6 0.0 0.5 1.0 1.5 0.0 0.5 1.0 1.5 0 2.0 Graph 6 2.5 3.0 3.
PAGE 9
XLAMP XP-E LEDS THERMAL DESIGN The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.
PAGE 10
XLAMP XP-E LEDS RELATIVE FLUX VS.
PAGE 11
Relative Lu Green 100 50 Graph 14 0 XLAMP XP-E LEDS 0 100 200 300 400 500 600 700 800 900 1000 Forward Current (mA) RELATIVE FLUX VS.
PAGE 12
XLAMP XP-E LEDS REFLOW SOLDERING CHARACTERISTICS In testing, Cree has found XLamp XP-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder 3°C/second max.
PAGE 13
XLAMP XP-E LEDS NOTES Lumen Maintenance Projections Based on internal long-term reliability testing, Cree projects royal blue, blue, green and white XLamp XP-E LEDs to maintain an average of 70% lumen maintenance after 50,000 hours, provided the LED junction temperature is maintained at or below 135°C and the LED is operated with a constant current of up to 700 mA.
PAGE 14
XLAMP XP-E LEDS All Measurements are .13mm unless otherwise indicated MECHANICAL DIMENSIONS (TA = 25°C) All measurements are ±.13 mm unless otherwise indicated. 3.30 2.00 3.45 .73 2.30 .50 3.45 2.6 1.30 Top View .50 Side View .50 Bottom View .60 1.30 1.20 .60 .65 .50 .40 3.20 3.30 1.60 1.65 .40 .40 .40 .50 3.20 3.30 RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) Copyright © 2008-2010 Cree, Inc. All rights reserved.
PAGE 15
XLAMP XP-E LEDS TAPE AND REEL All dimensions in mm. 1.5±.1 4.0±.1 8.0±.1 1.75±.10 2.5±.1 Cathode Side +.3 12.0 .0 Anode Side (denoted by + and circle) User Feed Direction END START Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2008-2010 Cree, Inc. All rights reserved.
PAGE 16
XLAMP XP-E LEDS Dessicant Desiccant (inside bag) (inside bag) Humidity Indicator Humidity Indicator Card (inside bag)bag) (inside PACKAGING All dimensions in mm.