Datasheet
Copyright © 2008-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
12
XLAMP XP-E LEDS
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XP-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp) 3°C/second max. 3°C/second max.
Preheat: Temperature Min (Ts
min
) 100°C 150°C
Preheat: Temperature Max (Ts
max
) 150°C 200°C
Preheat: Time (ts
min
to ts
max
) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (T
L
) 183°C 217°C
Time Maintained Above: Time (t
L
) 60-150 seconds 60-150 seconds
Peak/Classication Temperature (Tp) 215°C 260°C
Time Within 5°C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate 6°C/second max. 6°C/second max
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.