Data Sheet

MPU-6000/MPU-6050 Product Specification
Document Number: PS-MPU-6000A-00
Revision: 3.4
Release Date: 08/19/2013
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Temperature Set Points Corresponding to Reflow Profile Above
Step
Setting
CONSTRAINTS
Temp (°C)
Time (sec)
Max. Rate (°C/sec)
A
T
room
25
B
T
Smin
150
C
T
Smax
200
60 < t
BC
< 120
D
T
Liquidus
217
r
(TLiquidus-TPmax)
< 3
E
T
Pmin [255°C, 260°C]
255
r
(TLiquidus-TPmax)
< 3
F
T
Pmax [ 260°C, 265°C]
260
t
AF
< 480
r
(TLiquidus-TPmax)
< 3
G
T
Pmin [255°C, 260°C]
255
10< t
EG
< 30
r
(TPmax-TLiquidus)
< 4
H
T
Liquidus
217
60 < t
DH
< 120
I
T
room
25
Notes: Customers must never exceed the Classification temperature (T
Pmax
= 260°C).
All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use
lead-free solders that have lower specified temperature profiles (Tp
max
~ 235°C). Also use lower ramp-up and
ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we
used for qualification, as these represent the maximum tolerable ratings for the device.
11.5 Storage Specifications
The storage specification of the MPU-60X0 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity
Level (MSL) 3.
Calculated shelf-life in moisture-sealed bag
12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168 hours -- Storage conditions: ambient ≤30°C at 60%RH
11.6 Package Marking Specification
INVENSENSE
MPU6000
X X X X X X-X X
X X Y Y W W X
Lot traceability code
Foundry code
Package Vendor Code
Rev Code
Y Y = Year Code
W W = Work Week
TOP VIEW
Part number
INVENSENSE
MPU6050
X X X X X X-X X
X X Y Y W W X
TOP VIEW
Package Marking Specification