Datasheet

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13
xlamp xp-e leds
REFLOW SOLDERING CHARACTERISTICS
     

manufacturer of solder paste used.

Prole Feature Lead-Based Solder Lead-Free Solder


to Tp)  

min
) 100 °C 150 °C


) 150 °C 200 °C

min
to ts

) 60-120 seconds 60-180 seconds

L
) 183 °C 217 °C

L
) 60-150 seconds 60-150 seconds
 215 °C 260 °C
Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate  
Time 25 °C to Peak Temperature  
