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ManualsBrandsUnbranded ManualsPMICsPMIC - motor controllers STMicroelectronics Half-bridge (2) Parallel, PWM PowerSSO 36

September 2013 Doc ID 16009 Rev 11 1/33

VNH5050A-E

Automotive fully integrated H-bridge motor driver

Features

■

Output current: 30 A

■

3 V CMOS compatible inputs

■

Undervoltage and overvoltage shutdown

■

Overvoltage clamp

■

Thermal shutdown

■

Cross-conduction protection

■

Current and power limitation

■

Very low standby power consumption

■

PWM operation up to 20 KHz

■

Protection against loss of ground and loss of

■

Current sense output proportional to motor

current

■

Output protected against short to ground and

short to V

■

Package: ECOPACK

Description

The VNH5050A-E is a full bridge motor driver

intended for a wide range of automotive

applications. The device incorporates a dual

monolithic high-side driver and two low-side

switches. All switches are designed using

STMicroelectronics

well known and proven

proprietary VIPower

M0 technology that allows

to efficiently integrate on the same die a true

Power MOSFET with an intelligent

signal/protection circuitry. The three dies are

assembled in a PowerSSO-36 TP package on

electrically isolated lead frames. This package,

specifically designed for the harsh automotive

environment offers improved thermal

performance thanks to exposed die pads.

Moreover, its fully symmetrical mechanical design

allows superior manufacturability at board level.

The input signals IN

and IN

can directly

interface to the microcontroller to select the motor

direction and the brake condition. The DIAG

/EN

or DIAG

/EN

, when connected to an external

pull-up resistor, enables one leg of the bridge.

Each DIAG

/EN

provides a digital diagnostic

feedback signal as well. The normal operating

condition is explained in the truth table. The CS

pin allows monitoring the motor current by

delivering a current proportional to its value when

CS_DIS pin is driven low or left open. When

CS_DIS is driven high, CS pin is in high

impedance condition. The PWM, up to 20 KHz,

allows to control the speed of the motor in all

possible conditions. In all cases, a low level state

on the PWM pin turns off both the LS

and LS

switches.

Type R

DS(on)

out

ccmax

VNH5050A-E

50 mΩ max

(per leg)

30 A 41 V

PowerSSO-36 TP

Table 1. Device summary

Package

Order codes

Tube Tape and reel

PowerSSO-36 TP VNH5050A-E VNH5050ATR-E

www.st.com

Summary of content (33 pages)

PAGE 1
VNH5050A-E Automotive fully integrated H-bridge motor driver Features Type RDS(on) Iout Vccmax VNH5050A-E 50 mΩ max (per leg) 30 A 41 V ■ Output current: 30 A ■ 3 V CMOS compatible inputs ■ Undervoltage and overvoltage shutdown ■ Overvoltage clamp ■ Thermal shutdown ■ Cross-conduction protection ■ Current and power limitation ■ Very low standby power consumption ■ PWM operation up to 20 KHz ■ Protection against loss of ground and loss of VCC ■ Current sense output proportional t
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Contents VNH5050A-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Electrical characteristics . . . . . . . . .
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VNH5050A-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Block description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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List of figures VNH5050A-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. 4/33 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . .
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VNH5050A-E 1 Block diagram and pin description Block diagram and pin description Figure 1.
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Block diagram and pin description Table 3. VNH5050A-E Suggested connections for unused and not connected pins Connection / pin Current sense N.C. SOURCE_HSx DRAIN_LSx INPUTx, PWM DIAGx/ENx CS_DIS Floating Not allowed X X X X To ground Through 1 kΩ resistor X Not allowed X Through 10 kΩ resistor Figure 2.
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VNH5050A-E Block diagram and pin description Table 4. Pin definitions and functions (continued) Pin N° Symbol Function 20 CS_DIS Active high CMOS compatible pin to disable current sense pin. 21 ENB/DIAGB 22 INB 23, 25, 26, 27, 28, 29, 35 GND_B Source of low-side switch B. OUTA, Heat Source of high-side switch A / drain of low-side switch A. Slug2 1, 3, 4, 5, 6, 7 Table 5. Counter clockwise input. OUTB, Heat Source of high-side switch B / drain of low-side switch B.
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Electrical specifications 2 VNH5050A-E Electrical specifications Figure 3. Current and voltage conventions IS VCC IINA IINB IENA IENB VCC INA INB CS CS_DIS DIAGB/ENB PWM IGND ICSD VOUTB VSENSE VCSD Vpw Absolute maximum ratings Table 6.
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VNH5050A-E 2.2 Electrical specifications Thermal data Table 7. Symbol Thermal data Parameter Rthj-case Thermal resistance junction-case (per leg) Rthj-amb Thermal resistance junction-ambient Doc ID 16009 Rev 11 Max. value Unit HSD 3.7 °C/W LSD 3.
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Electrical specifications 2.3 VNH5050A-E Electrical characteristics VCC = 9 V up to 18 V; -40 °C < Tj < 150 °C, unless otherwise specified. Table 8. Power section Symbol Parameter Test conditions VCC Operating supply voltage Min. 5.
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VNH5050A-E Electrical specifications Table 9. Symbol Logic inputs (INA, INB, ENA, ENB, PWM, CS_DIS) Parameter Test conditions Min. Typ. Max. Unit 0.9 V VIL Input low level voltage Normal operation (DIAGX/ENX pin acts as an input pin) VIH Input high level voltage Normal operation (DIAGX/ENX pin acts as an input pin) 2.1 V VIHYST Input hysteresis voltage Normal operation (DIAGX/ENX pin acts as an input pin) 0.15 V IIN = 1 mA 5.5 6.3 7.5 V IIN = -1 mA -1.0 -0.7 -0.
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Electrical specifications Table 11. Symbol VNH5050A-E Protections and diagnostics (continued) Parameter Test conditions Min. Typ. Max. Unit 30 50 70 A ISD_LS Shutdown LS current VCLP Total clamp voltage (VCC to GND) IOUT = 8.5 A 41 46 52 V VCLPH High-side clamp voltage (VCC to OUTA =0 or OUTB =0) IOUT = 8.5 A 41 46 52 V TSD_LS Time to shutdown for the low-side VCLPLS Low-side clamp voltage (OUTA = VCC or OUTB = VCC to GND) IOUT = 8.
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VNH5050A-E Electrical specifications Table 12. Symbol VSENSE Current sense (9 V < VCC < 18 V) (continued) Parameter Max analog sense output voltage ISENSETYP_500 Typical analog sense ISENSE0 Analog sense leakage current Test conditions IOUT = 10 A; VCSD = 0 V; RSENSE = 800 Ω Min. Typ. Max.
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Electrical specifications Figure 4.
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VNH5050A-E Figure 5. Electrical specifications Definition of the low-side switching times PWM t VOUTA, B 90% tf Figure 6.
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Electrical specifications Figure 7. VNH5050A-E Definition of dynamic cross conduction current during a PWM operation INA = 1, INB = 0 PWM t IMOTOR t VOUTB t ICC IRM t trr Figure 8.
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VNH5050A-E Electrical specifications Table 13. Truth table in normal operating conditions INA INB DIAGA/ENA DIAGB/ENB OUTA OUTB 1 H 1 CS High Imp. H 0 1 1 H 0 Brake to VCC Clockwise (CW) L 1 Operating mode ISENSE = IOUT/K Counterclockwise (CCW) L 0 Table 14. INA L High Imp.
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Electrical specifications Table 15. ISO 7637-2: 2004(E) Test pulse VNH5050A-E Electrical transient requirements (part 1/3) Test levels(1) III IV 1 -75V -100V 2a +37V 3a Number of pulses or test times Burst cycle/pulse repetition time Delays and Impedance Min. Max. 5000 pulses 0.5s 5s 2 ms, 10Ω +50V 5000 pulses 0.2s 5s 50µs, 2Ω -100V -150V 1h 90ms 100ms 0.1µs, 50Ω 3b +75V +100V 1h 90ms 100ms 0.1µs, 50Ω 4 -6V -7V 1 pulse 100ms, 0.
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VNH5050A-E 2.4 Electrical specifications Waveforms Figure 9.
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Electrical specifications VNH5050A-E Figure 10.
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VNH5050A-E 3 Application information Application information In normal operating conditions the DIAGX/ENX pin is considered as an input pin by the device. This pin must be externally pulled high. PWM pin usage: In all cases, a “0” on the PWM pin turns off both LSA and LSB switches. When PWM rises back to “1”, LSA or LSB turn on again depending on the input pin state. Figure 11. Typical application circuit for DC to 20 kHz PWM operation short circuit protection VCC Reg 5V +5V + 5V VCC 3.3K 3.
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Application information VNH5050A-E In any case, when a fault is detected, the faulty leg of the bridge is latched off. To turn on the respective output (OUTX) again, the input signal must rise from low to high level. Figure 12.
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VNH5050A-E Application information Series resistor must be inserted to limit the current sunk from the microcontroller I/Os. If IRmax is the maximum target reverse current through µC I/Os, series resistor is: V –V IOs CC R = --------------------------------I Rmax Figure 13. Half-bridge configuration VCC INA INB DIAGA/ENA DIAGB/ENB PWM INA INB DIAGA/ENA DIAGB/ENB PWM OUTA M OUTB GND GND Note: OUTB OUTA The VNH5050A-E can be used as a high power half-bridge driver. Figure 14.
PAGE 24
Package and PCB thermal data VNH5050A-E 4 Package and PCB thermal data 4.1 PowerSSO-36 thermal data Figure 15. PowerSSO-36™ PC board Double layers: footprint Double layers: 2cm2 of Cu Double layers: 8cm2 of Cu Four layers: Cu on top layer: 16 cm2; Cu on bottom layer: 32 cm2; Cu on middle layer: total coverage Note: 24/33 Board finish thickness 1.6 mm +/- 10%, Board double layers and four layers, Board dimension 129x60, Board Material FR4, Cu thickness 0.
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VNH5050A-E Package and PCB thermal data Figure 16. Chipset configuration HIGH SIDE CHIP HSAB LOW SIDE CHIP A LOW SIDE CHIP B LSA LSB Figure 17. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition 80 RthA 70 RthB = RthC 60 RthAB = RthAC RthBC 50 40 °C/W 30 20 10 0 0 2 4 6 8 10 12 cm2 of Cu Area (refer to PCB layout) 4.1.1 Thermal calculation in clockwise and anti-clockwise operation in steady-state mode Table 18.
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Package and PCB thermal data VNH5050A-E RthHSLS = RthHSALSB = RthHSBLSA = Mutual Thermal Resistance Junction to Ambient between High Side and Low Side Chips RthLSLS = RthLSALSB = Mutual Thermal Resistance Junction to Ambient between Low Side Chips 4.1.
PAGE 27
VNH5050A-E Package and PCB thermal data Figure 19. PowerSSO-36 HSD thermal impedance junction ambient single pulse 100 °C/W 10 HSD-footprint HSD-2 cm^2 Cu HSD-8 cm^2 Cu HSD-4 Layer HsLsD-footprint HsLsD-2 cm^2 Cu HsLsD-8 cm^2 Cu HsLsD-4 Layer 1 0.1 0.001 0.01 0.1 time (sec) 1 10 100 1000 Figure 20.
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Package and PCB thermal data VNH5050A-E Figure 21. Thermal fitting model of an H-bridge in PowerSSO-36 Table 19. Thermal parameters(1) Area/island (cm2) Footprint R1 = R7 (°C/W) 0.4 R2 = R8 (°C/W) 2 2 8 4L R3 (°C/W) 8 R4 (°C/W) 30 16 16 10 R5 (°C/W) 40 22 12 5 R6 (°C/W) 36 28 10 6 R9 = R15 (°C/W) 0.1 R10 = R16 (°C/W) 3.
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VNH5050A-E Package and packing information 5 Package and packing information 5.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 5.2 PowerSSO-36 TP package information Figure 22.
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Package and packing information Table 20. VNH5050A-E PowerSSO-36 TP mechanical data Millimeters Symbol Min. Typ. Max. A 2.15 - 2.47 A2 2.15 - 2.40 a1 0 - 0.1 b 0.18 - 0.36 c 0.23 - 0.32 D 10.10 - 10.50 E 7.4 - 7.6 e - 0.5 - e3 - 8.5 - F 2.3 G - - 0.1 H 10.1 - 10.5 h - - 0.4 k 0 deg L 0.6 M N 30/33 8 deg - 1 4.3 - - O 1.2 Q 0.8 S 2.9 T 3.65 U 1.0 10 deg X1 1.85 2.35 Y1 3 3.5 X2 1.85 2.35 Y2 3 3.5 X3 4.7 - 5.
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VNH5050A-E 5.3 Package and packing information PowerSSO-36 TP packing information Figure 23. PowerSSO-36 TP tube shipment (no suffix) Base Qty Bulk Qty Tube length (±0.5) A B C (±0.1) C B 49 1225 532 3.5 13.8 0.6 All dimensions are in mm. A Figure 24. PowerSSO-36 TP tape and reel shipment (suffix “TR”) Reel dimensions Base Qty Bulk Qty A (max) B (min) C (±0.2) F G (+2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 100 30.
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Revision history 6 VNH5050A-E Revision history Table 21. Document revision history Date Revision 06-Jul-2009 1 Initial release. 2 Updated Figure 1: Block diagram. Updated following tables: – Table 2: Block description – Table 6: Absolute maximum ratings – Table 8: Power section – Table 11: Protections and diagnostics – Table 12: Current sense (9 V < VCC < 18 V) – Table 14: Truth table in fault conditions (detected on OUTA) Updated Chapter 3: Application information.
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VNH5050A-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.