User's Manual

盟訊實業股份有限公司
Unication CO., LTD.
機密等級：□極機密 ■機密 □普通
第 22 页 共 25 页
Figure 10 –Suggest Inhibit Area
3.9.4 Debug of the GM601 in Production
To test and debug the mounting of the GM601, we strongly recommend to foreseen test pads on the
host PCB, in order to check the connection between the GM601 itself and the application and to test the performance of
the module connecting it with an external computer. Depending by the customer application, these pads include, but are
not limited to the following signals:
 • TXD
 • RXD
 • ON/OFF
 • RESET
 • GND
 • VBATT
 • TX_TRACE
 • RX_TRACE
 • PWRMON
3.9.5 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120μm.
3.9.6
PCB Pad Design
Non solder mask defined type is recommended for the solder pads on the PCB.