User's Manual

盟訊實業股份有限公司
Unication CO., LTD.
機密等級：□極機密 ■機密 □普通
第 23 页 共 25 页
Figure 11 –PCB pad design
Recommendation for PCB pad dimensions:
Ball pitch(mm) 2.5
Solder resist opening diameter A (mm) 1.150
Metal pad diameter B (mm) 1+/-0.05
It is recommended no microvia without solder resist cover under the module and no microvia around the pads
(see following figure):
Figure 12 –microvia without solder resist cover area
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer thickness(um) Properties
Electro-less Ni/Immersion Au 3-7/0.05-0.15 Good solder ability protection, high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.