Specifications

BTA3X Module Specification
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➢ 9. Handling Precautions
This part specifically describes the wishes and conditions for storage, baking and mounting.
9.1 Recommended Reflow Profile
Key features of the profile:
- Initial Ramp = 1-3°C /sec to 175°C equilibrium
- Equilibrium time = 60 to 90 seconds
- Ramp to Maximum temperature (255°C) = 3°C /sec Max
- Time above liquidus temperature (217°C): 60 – 90 seconds
- Device absolute maximum reflow temperature: 255℃
- Possible times of Reflow: ≤3 times
9.2 Storage and Baking Conditions
(1) If the moisture-proof package is not opened after shipment, please store in an environment of 25±3°C,
30%～60%RH.
(2) After open the moisture-proof packaging, please complete all mounting work within 168 hours.
(3) Baking Condition: if the criteria in (1), (2) are not met, please bake at 55°C, 24hours, in principle, baking
should be done once.