User's Manual

9
Mechanical Characteristics
The board weighs 8.5 grams, it is 30 mm wide and 50.95 mm tall. The dimensions of the module fall
completely within the PCI Express Mini Card Electromechanical Specification, except for the card's
thickness (maximum 5.2 mm at its thickest).
Figure 4: Module Dimension
Operating Conditions
Parameter
Min
Typical
Max
Remarks
Normal operating
Temperature
-40 °C
+25 °C
+85 °C
Normal operating temperature range (fully
functional and meet 3GPP specifications)
NOTE:
Unless otherwise indicated, all operating condition specifications are at an ambient temperature
of 25°C. Operation beyond the operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
Schematic Diagram
UP100 gateway module refers to Semtech's reference design for SX1303. The SPI interface can be
used on the mini-PCIe connector. The next figure shows the minimum application schematic of the
UP100. You should use at least 3.3V/1A DC power, connect the SPI interface to the main processor.