User's Manual

Wireless Product Business Unit / Hardware Development Division
1. Scope: This PCB SPEC is for EV board of HOOK_REV3.0. This document define the PCB
(Printed Circuit Board) manufacturing SPEC. Due to this product are applied in wireless
communication field, so all the SPEC defined in this document should be followed strictly in
order to control the line impedance and parasitic effects. Any changes or modification must
have written agreement of USI’s engineer.
2. Gerber file : GB_HOOK_EVB_V30_20180328_Lyly.zip
3. PCB Thickness: 54.86mil+/- 10%
4. PCB size: Per Gerber
5. Four Layer PCB
6. PCB Material: FR4, , r: 4.2 +/-0.2
7. Surface finish: ENIG
8. RoHS and Halogen free compliant is necessary for all materials
9. Layer Stack:
- Layer 1: Component Top
- Layer 2: GND layer
- Layer 3: Inner layer traces/ power traces
- Layer 4: Component Bottom
10. The PCB stack is as follows: (unit :mil)
The PCB stack is as follows:
(unit :mil)
Layer
Thickness
Solder Mask
0.7
L1
1.6
P.P
10.53
L2
0.6
Core
28
L3
0.6
PP
10.53
L4
1.6
Solder mask
0.7
Total
54.86
11. Trace width/clearance: 5mils / 5 mils
12. Via type : L1-L4 , PTH , minimum via : 10mil hole / 20mil ring