Datasheet
Table Of Contents
- ISD1800 series
- 1. GENERAL DESCRIPTION
- 2. FEATURES
- 3. BLOCK DIAGRAM
- 4. PIN CONFIGURATION
- 5. PIN DESCRIPTION
- 6. FUNCTIONAL DESCRIPTION
- 7. TIMING DIAGRAMS
- 8. ABSOLUTE MAXIMUM RATINGS [1]
- 9. ELECTRICAL CHARACTERISTICS
- 10. TYPICAL APPLICATION CIRCUIT
- 11. PACKAGE DRAWING AND DIMENSIONS
- 12. ORDERING INFORMATION
- 13. VERSION HISTORY
- Headquarters Nuvoton Technology Corporation America Nuvoton Technology (Shanghai) Ltd.
ISD1800 SERIES
Publication Release Date: Jan 15, 2016
- 2 - Revision 1.0
1. GENERAL DESCRIPTION ............................................................................................................... 3
2. FEATURES ....................................................................................................................................... 3
3. BLOCK DIAGRAM ............................................................................................................................ 4
4. PIN CONFIGURATION ..................................................................................................................... 5
5. PIN DESCRIPTION ........................................................................................................................... 6
6. FUNCTIONAL DESCRIPTION ......................................................................................................... 9
6.1. Detailed Description .................................................................................................................. 9
6.2. Functional Description Example .............................................................................................. 10
7. TIMING DIAGRAMS ....................................................................................................................... 12
8. ABSOLUTE MAXIMUM RATINGS
[1]
.............................................................................................. 16
8.1. Operating Conditions............................................................................................................... 17
9. ELECTRICAL CHARACTERISTICS ............................................................................................... 18
9.1. DC Parameters ....................................................................................................................... 18
9.2. AC Parameters
[1]
..................................................................................................................... 19
10. TYPICAL APPLICATION CIRCUIT ................................................................................................. 20
11. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 22
11.1. 28-Lead 300mil Small Outline IC (SOIC) Package – Samples Only ................................... 22
11.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) – Samples Only ................................. 23
11.3. ISD1800 Bonding Physical Layout (Die) .............................................................................. 24
12. ORDERING INFORMATION .......................................................................................................... 25
13. VERSION HISTORY ........................................................................................................................ 26