Datasheet
Table Of Contents
- ISD1800 series
- 1. GENERAL DESCRIPTION
- 2. FEATURES
- 3. BLOCK DIAGRAM
- 4. PIN CONFIGURATION
- 5. PIN DESCRIPTION
- 6. FUNCTIONAL DESCRIPTION
- 7. TIMING DIAGRAMS
- 8. ABSOLUTE MAXIMUM RATINGS [1]
- 9. ELECTRICAL CHARACTERISTICS
- 10. TYPICAL APPLICATION CIRCUIT
- 11. PACKAGE DRAWING AND DIMENSIONS
- 12. ORDERING INFORMATION
- 13. VERSION HISTORY
- Headquarters Nuvoton Technology Corporation America Nuvoton Technology (Shanghai) Ltd.
ISD1800 SERIES
Publication Release Date: Jan 15, 2016
- 24 - Revision 1.0
11.3. ISD1800 BONDING PHYSICAL LAYOUT (DIE)
Notes:
1. The backside of die is internally connected to V
SS
. It MUST NOT be connected to any other potential or
damage may occur.
2. Die thickness is subject to change, please contact Nuvoton factory for status and availability.
ISD1800
PLAYL PLAYE REC V
SSD
V
CCD
XCLK FT
MIC MIC REF AGC SP - V
SSA
SP + V
CCA
ROSC
RECLED