Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1Introduction
- 2Product Concept
- 3Application Interfaces
- 3.1.General Description
- 3.2.Pin Assignment
- 3.3.Pin Description
- 3.4.Power Supply
- 3.5.Turn on and off Scenarios
- 3.6.VRTC Interface
- 3.7.Power Output
- 3.8.Battery Charge and Management
- 3.9.USB Interface
- 3.10.UART Interfaces
- 3.11.(U)SIM Interfaces
- 3.12.SD Card Interface
- 3.13.GPIO Interfaces
- 3.14.I2C Interfaces
- 3.15.ADC Interfaces
- 3.16.Motor Drive Interface
- 3.17.LCM Interface
- 3.18.Touch Panel Interface
- 3.19.Camera Interfaces
- 3.20.Sensor Interfaces
- 3.21.Audio Interfaces
- 3.22.Emergency Download Interface
- 4Wi-Fi and BT
- 5GNSS
- 6Antenna Interface
- 7Electrical, Reliability and Radio Characteristics
- 8Mechanical Dimensions
- 9Storage, Manufacturing and Packaging
- 10Appendix A References
- 11Appendix B GPRS Coding Schemes
- 12Appendix C GPRS Multi-slot Classes
- 13Appendix D EDGE Modulation and Coding Schemes
Smart LTE Module Series
SC20 Hardware Design
SC20_Hardware_Design Confidential / Released
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FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)...................................................... 80
FIGURE 40: MECHANICALS OF UF.L-LP CONNECTORS.......................................................................................81
FIGURE 41: SPACE FACTOR OF MATED CONNECTORS (UNIT: MM)................................................................ 81
FIGURE 42: MODULE TOP AND SIDE DIMENSIONS............................................................................................ 106
FIGURE 43: MODULE BOTTOM DIMENSIONS (TOP VIEW).................................................................................107
FIGURE 44: RECOMMENDED FOOTPRINT (TOP VIEW)......................................................................................108
FIGURE 45: TOP VIEW OF THE MODULE................................................................................................................109
FIGURE 46: BOTTOM VIEW OF THE MODULE.......................................................................................................109
FIGURE 47: RECOMMENDED STENCIL DESIGN FOR LGA PADS.....................................................................111
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE..................................................................................... 112
FIGURE 49: TAPE DIMENSIONS.................................................................................................................................113
FIGURE 50: REEL DIMENSIONS................................................................................................................................ 113