Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1Introduction
- 2Product Concept
- 3Application Interfaces
- 3.1.General Description
- 3.2.Pin Assignment
- 3.3.Pin Description
- 3.4.Power Supply
- 3.5.Turn on and off Scenarios
- 3.6.VRTC Interface
- 3.7.Power Output
- 3.8.Battery Charge and Management
- 3.9.USB Interface
- 3.10.UART Interfaces
- 3.11.(U)SIM Interfaces
- 3.12.SD Card Interface
- 3.13.GPIO Interfaces
- 3.14.I2C Interfaces
- 3.15.ADC Interfaces
- 3.16.Motor Drive Interface
- 3.17.LCM Interface
- 3.18.Touch Panel Interface
- 3.19.Camera Interfaces
- 3.20.Sensor Interfaces
- 3.21.Audio Interfaces
- 3.22.Emergency Download Interface
- 4Wi-Fi and BT
- 5GNSS
- 6Antenna Interface
- 7Electrical, Reliability and Radio Characteristics
- 8Mechanical Dimensions
- 9Storage, Manufacturing and Packaging
- 10Appendix A References
- 11Appendix B GPRS Coding Schemes
- 12Appendix C GPRS Multi-slot Classes
- 13Appendix D EDGE Modulation and Coding Schemes
Smart LTE Module Series
SC20 Hardware Design
SC20_Hardware_Design Confidential / Released
9-111
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9.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality,
the thickness of stencil for the module is recommended to be 0.18mm. For more details, please refer to
document [3].
Figure 47: Recommended Stencil Design for LGA Pads
It is suggested that the peak reflow temperature is from 235ºC to 245ºC (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below: