User Guide

iii
Declaration of RoHS2 Compliance
This product has been designed and manufactured in compliance with Directive 2011/65/EU of the
European Parliament and the Council on restriction of the use of certain hazardous substances in
electrical and electronic equipment (RoHS2 Directive) and is deemed to comply with the maximum
concentration values issued by the European Technical Adaptation Committee (TAC) as shown
below:
Substance
Proposed Maximum
Concentration
Actual Concentration
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Cadmium (Cd) 0.01% < 0.01%
Hexavalent Chromium (Cr
6+
) 0.1% < 0.1%
Polybrominated biphenyls (PBB) 0.1% < 0.1%
Polybrominated diphenyl ethers (PBDE) 0.1% < 0.1%
Bis (2-ethylhexyl) phthalate (DEHP) 0.1% < 0.1%
Butyl benzyl phthalate (BBP) 0.1% < 0.1%
Dibutyl phthalate (DBP) 0.1% < 0.1%
Diisobutyl phthalate (DIBP ) 0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex III of the RoHS2
Directives as noted below:
Examples of exempted components are:
1. 0HUFXU\LQFROGFDWKRGHÀXRUHVFHQWODPSVDQGH[WHUQDOHOHFWURGHÀXRUHVFHQWODPSV&&)/DQG
EEFL) for special purposes not exceeding (per lamp):
(1) Short length (≦500 mm): maximum 3.5 mg per lamp.
(2) Medium length (＞500 mm and ≦1,500 mm): maximum 5 mg per lamp.
(3) Long length (＞1,500 mm): maximum 13 mg per lamp.
2. Lead in glass of cathode ray tubes.
3. /HDGLQJODVVRIÀXRUHVFHQWWXEHVQRWH[FHHGLQJE\ZHLJKW
4. Lead as an alloying element in aluminium containing up to 0.4% lead by weight.
5. Copper alloy containing up to 4% lead by weight.
6. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight
or more lead).
7. Electrical and electronic components containing lead in a glass or ceramic other than dielectric
ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.