User Guide
Table Of Contents
- Table of contents
- Important safety instructions
- Introduction
- Positioning your projector
- Connection
- Operation
- Starting up the projector
- Using the menus
- Utilizing the password function
- Switching input signal
- Adjusting the projected image
- Magnifying and searching for details
- Selecting the aspect ratio
- Optimizing the image
- Setting the presentation timer
- Hiding the image
- Locking control keys
- Operating in a high altitude environment
- Using the CEC function
- Using the 3D functions
- Using the projector in standby mode
- Adjusting the sound
- Shutting down the projector
- Menu operation
- Maintenance
- Troubleshooting
- Specifications
- Copyright information
iii
Declaration of RoHS2 Compliance
This product has been designed and manufactured in compliance with Directive
2011/65/EU of the European Parliament and the Council on restriction of the use
of certain hazardous substances in electrical and electronic equipment (RoHS2
Directive) and is deemed to comply with the maximum concentration values issued
by the European Technical Adaptation Committee (TAC) as shown below:
Substance
Proposed Maximum
Concentration
Actual Concentration
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Cadmium (Cd) 0.01% < 0.01%
Hexavalent Chromium (Cr
6+
) 0.1% < 0.1%
Polybrominated biphenyls (PBB) 0.1% < 0.1%
Polybrominated diphenyl ethers (PBDE) 0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex III
of the RoHS2 Directives as noted below:
Examples of exempted components are:
1.
lamps (CCFL
and EEFL) for special purposes not exceeding (per lamp):
(1) Short length (≦500 mm): maximum 3.5 mg per lamp.
(2) Medium length (>500 mm and ≦1,500 mm): maximum 5 mg per lamp.
(3) Long length (>1,500 mm): maximum 13 mg per lamp.
2.
Lead in glass of cathode ray tubes.
3.
4. Lead as an alloying element in aluminium containing up to 0.4% lead by weight.
5.
Copper alloy containing up to 4% lead by weight.
6. Lead in high melting temperature type solders (i.e. lead-based alloys containing
85% by weight or more lead).
7. Electrical and electronic components containing lead in a glass or ceramic other
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound.