Datasheet

Molded Guide
www.vishay.com
Vishay Sprague
Revision: 02-Aug-18
6
Document Number: 40074
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
Preheat / soak
Temperature min. (T
s min.
) 100 °C 150 °C
Temperature max. (T
s max.
) 150 °C 200 °C
Time (t
s
) from (T
s min.
to T
s max.
) 60 s to 120 s 60 s to 120 s
Ramp-up
Ramp-up rate (T
L
to T
p
) 3 °C/s max. 3 °C/s max.
Liquidus temperature (T
L
) 183 °C 217 °C
Time (t
L
) maintained above T
L
60 s to 150 s 60 s to 150 s
Peak package body temperature (T
p
) Depends on case size - see table below
Time (t
p
) within 5 °C of the specified
classification temperature (T
C
)
20 s 30 s
Time 25 °C to peak temperature 6 min max. 8 min max.
Ramp-down
Ramp-down rate (T
p
to T
L
) 6 °C/s max. 6 °C/s max.
25
TEMPERATURE (°C)
TIME (s)
t
s
t
L
Time 25 °C to peak
T
L
T
p
T
C
- 5 °C
t
p
T
s max.
T
s min.
Preheat area
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
PEAK PACKAGE BODY TEMPERATURE (T
p
)
CASE CODE
PEAK PACKAGE BODY TEMPERATURE (T
p
)
SnPb EUTECTIC PROCESS LEAD (Pb)-FREE PROCESS
A, B, C, V 235 °C 260 °C
D, E, W 220 °C 250 °C
PAD DIMENSIONS in inches [millimeters]
CASE CODE
A
(MIN.)
B
(NOM.)
C
(NOM.)
D
(NOM.)
MOLDED CHIP CAPACITORS, ALL TYPES
A 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75]
B 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25]
C 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80]
D 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
E 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
V 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
W 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
A
B
C
D