Datasheet

BZM55-Series
www.vishay.com
Vishay Semiconductors
Rev. 2.2, 27-Feb-2019
1
Document Number: 85597
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Small Signal Zener Diodes
DESIGN SUPPORT TOOLS AVAILABLE
FEATURES
• Saving space
• Hermetic sealed parts
• Electrical data identical with the devices
BZT55..series, TZM..series
• Fits onto SOD-323
• Very sharp reverse characteristic
• Low reverse current level
• Very high stability
•Low noise
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Voltage stabilization
PRIMARY CHARACTERISTICS
PARAMETER VALUE UNIT
V
Z
range nom. 2.4 to 75 V
Test current I
ZT
2.5; 5 mA
V
Z
specification Pulse current
Circuit configuration Single
3
3
D
D
3
D
3D Models
ORDERING INFORMATION
DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY
BZM55-series BZM55-series-TR3 10 000 (8 mm tape on 13" reel) 10 000
BZM55-series BZM55-series-TR 2500 (8 mm tape on 7" reel) 12 500
PACKAGE
PACKAGE NAME WEIGHT
MOLDING COMPOUND
FLAMMABILITY RATING
MOISTURE SENSITIVITY
LEVEL
SOLDERING CONDITIONS
MicroMELF 12 mg UL 94 V-0
MSL level 1
(according J-STD-020)
Peak temperature max. 260°C
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Power dissipation R
thJA
 300 K/W P
tot
500 mW
Junction to ambient air Mounted on epoxy-glass hard tissue, fig. 1 R
thJA
500 K/W
Junction tie point
35 μm copper clad, 0.9 mm
2
copper area per
electrode
R
thJL
300 K/W
Junction temperature T
j
175 °C
Storage temperature range T
stg
-65 to +175 °C
Zener current I
Z
P
tot
/V
Z
mA
Forward voltage I
F
= 200 mA V
F
1.5 V