Datasheet

KBU6A, KBU6B, KBU6D, KBU6G, KBU6J, KBU6K, KBU6M
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Vishay General Semiconductor
Revision: 23-Jun-14
2
Document Number: 88657
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Notes
(1)
Thermal resistance from junction to ambient with units in free air, PCB mounted on 0.5" x 0.5" (12 mm x 12 mm) copper pads, 0.375"
(9.5 mm) lead length
(2)
Thermal resistance from junction to case with units mounted on a 2.6" x 1.4"x 0.06" thick (6.5 cm x 3.5 cm x 0.15 cm) Al. plate
RATINGS AND CHARACTERISTICS CURVES (T
A
= 25 °C unless otherwise noted)
Fig. 1 - Derating Curve Output Rectified Current
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge
Current Per Diode
Fig. 3 - Typical Instantaneous Forward Characteristics Per Diode
Fig. 4 - Typical Reverse Leakage Characteristics Per Diode
THERMAL CHARACTERISTICS (T
A
= 25 °C unless otherwise noted)
PARAMETER SYMBOL KBU6A KBU6B KBU6D KBU6G KBU6J KBU6K KBU6M UNIT
Typical thermal resistance
R
JA
(1)
8.6
°C/W
R
JC
(2)
3.1
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
KBU6J-E4/51 8.0 51 250 Anti-static PVC tray
50
100
150
0
2
4
6
0
PCB Mounting, T
A
0.375" (9.5 mm) Lead Length
with 0.5" x 0.5" (12 mm x 12 mm)
Copper Pad Areas
Heatsink Mounting,
T
C
, 2.6" x 1.4" x 0.06"
(6.5 cm x 3.5 cm x 1.5 cm)
Al. Plated
Temperature (°C)
Average Forward Current (A)
10
100
75
100
125
150
175
200
225
250
1
Number of Cycles at 60 Hz
Peak Forward Surge Current (A)
T
J
= 150 °C
Single Sine-Wave
1.0 Cycle
0.6
0.7
100
10
1
0.1
0.8
0.9
1.0
1.1
1.2
1.3
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
T
J
= 25 °C
Pulse Width = 300 µs
1 % Duty Cycle
0
20
40
60
80
100
0.01
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (µA)
T
J
= 100 °C
T
J
= 25 °C