Datasheet

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48 Revision: 05-Mar-12
MMU 0102, MMA 0204, MMB 0207 - Precision
Vishay Beyschlag
Precision MELF Resistors
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1)
The pulse load stability of professional MELF resistors applies for precision resistors also. However, severe pulse loads are likely to jeopardize
precision stability requirements.
(2)
Wave soldering is not recommended.
(3)
Special requirements apply to MICRO-MELF, MMU 0102:
- R < 100  ± (0.15 % R + 10 m).
- 100
R
10 k ± 0.1 %
R
.
- R > 10 k 0.05 %
R
.
(4)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.37 -
Periodic electric
overload;
standard
operation mode
U =
2 x U
max.
;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 %
R
+5 m
)
(1)
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s
2
; 7.5 h
± (0.01 %
R
+5 m
) ± (0.02 %
R
+5 m
) ± (0.03 %
R
+5 m
)
4.40 -
Electrostatic
discharge
(Human Body
Model)
IEC 61340-3-1
(4)
;
3 pos. + 3 neg. discharges
MMU 0102: 1.5 kV
MMA 0204: 2 kV
MMB 0207: 4 kV
± (0.5 %
R
+ 50 m
)
(1)
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux;
(215 ± 3) C; (3 ± 0.3) s
Good tinning (
95 % covered); no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) C; (2 ± 0.2) s
Good tinning (
95 % covered); no visible damage
4.18.2 58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) C; (10 ± 1) s
Note
(2)
± (0.05 %
R
+10 m
)
Reflow method 2
(IR/forced gas convection);
(260 ± 5) C; (10 ± 1) s
± (0.01 %
R
+5 m
) ± (0.025 %
R
+5 m
)
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol; 50 C;
method 2
No visible damage
4.30 45 (XA)
Solvent
resistance of
marking
Isopropyl alcohol; 50 C;
method 1, toothbrush
Marking legible; no visible damage
4.32 21 (Ue
3
) Shear (adhesion) 45 N
No visible damage
4.33 21 (Ue
1
)
Substrate
bending
Depth 2 mm, 3 times
No visible damage, no open circuit in bent position
± (0.02 %
R
+ 10 m
)
(3)
± (0.05 %
R
+ 10 m
)
(3)
4.7 - Voltage proof U
RMS
= U
ins
; 60 s
No flashover or breakdown
4.35 - Flammability
IEC 60 695-11-5
(4)
,
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
(4)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
STABILITY
CLASS 0.05
OR BETTER
STABILITY
CLASS 0.1
OR BETTER
STABILITY
CLASS 0.25
OR BETTER
MMU 0102
100
to 100 k
43
to 147 k
22
to 332 k
MMA 0204
100
to 100 k
43
to 221 k
10
to 511 k
MMB 0207
100
to 270 k
43
to 510 k
15
to 1 M