Datasheet

PR01/02/03
www.vishay.com
Vishay BCcomponents
Revision: 24-Jun-13
13
Document Number: 28729
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APPLICATION INFORMATION
PR03 Impedance as a function of applied frequency
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days).
The tests are carried out in accordance with IEC 60068-2-xx
Test Method under standard atmospheric conditions
according to IEC 60068-1, 5.3.
In the Test Procedures and Requirements table, tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given. In
some instances deviations from the IEC recommendations
were necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
10
3
10
2
101
10
2
1
10
10
-1
10
-2
Z
R
f (MHz )
= 18 Ω
n
= 1.3 kΩ
n
= 20 kΩ
n
= 1.5 Ω
= 100 kΩ
n
n
R
R
R
R
R
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4.1 Visual examination No holes; clean surface; nodamage
4.4.2 Dimensions (outline) Gauge (mm)
SeeStraight and Kinked Dimensions
tables
4.5
Resistance
(refer note on first
page for measuring
distance)
Applied voltage (+ 0 %/- 10 %):
R-R
nom:
max. ± 5 %
R<10: 0.1V
10R<100:0.3V
100 R<1k:1V
1kR <10k:3V
10kR<100k:10V
100kR<1M:25V
R= 1M:50V
4.18 20 (Tb)
Resistance to
soldering heat
Thermal shock: 10s;260 °C; 3mm from body R
max.
:± (1 %R +0.05)
4.29 45 (Xa)
Component solvent
resistance
Isopropyl alcohol or H
2
O
followed by brushing
No visual damage
4.17 20 (Ta) Solderability
2s;235°C; Solder bath method; SnPb40
3s;245°C; Solder bath method; SnAg3Cu0.5
Good tinning ( 95 % covered);
no damage
Solderability
(after ageing)
8h steam or 16h 155 °C;
leads immersed 6mm:
for 2s at 235 °C; solder bath (SnPb40)
for 3s at 245 °C; solder bath (SnAg3Cu0.5)
Good tinning ( 95 % covered);
no damage