Datasheet
Vishay Semiconductors
TLVD4200
Document Number 83058
Rev. 1.7, 20-Apr-11
www.vishay.com
1
For technical support, please contact: LED@vishay.com
This document is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DH Backlighting LED in Ø 3 mm Tinted Non-Diffused Package
DESCRIPTION
The TLVD4200 serie was developed for backlighting in
the extrem bright double heterojunction (DH) red
GaAlAs on GaAs technology. Due to its special shape
the spatial distribution of the radiation is qualified for
backlighting.
To optimize the brightness of backlighting a
custom-built reflector (with scattering) is required.
Uniform illumination can be enhanced by covering the
front of the reflector with diffusor material.
This is a bright and flexible solution for backlighting
different areas.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: 3 mm backlighting
• Product series: standard
• Angle of half intensity: ± 85°
FEATURES
• High brightness
• Wide viewing angle
• Categorized for luminous flux
• Available in DH red
• Tinted clear package
• Low power dissipation
• Low self heating
• Rugged design
• High reliability
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
• Backlighting of display panels, LCD displays,
symbols on switches, keyboards, graphic boards
and measuring scales
• Illumination of large areas e.g. dot matrix displays
** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902
19231
PARTS TABLE
PART COLOR, LUMINOUS FLUX TECHNOLOGY
TLVD4200
Red,
V
> 40 mlm
GaAIAs on GaAs
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage
V
R
6V
DC forward current
I
F
50 mA
Surge forward current
t
p
10 µs I
FSM
1A
Power dissipation
T
amb
60 °C P
V
100 mW
Junction temperature
T
j
100 °C
Operating temperature range
T
amb
- 40 to + 100 °C
Storage temperature range
T
stg
- 55 to + 100 °C
Soldering temperature
t 5 s, 2 mm from body T
sd
260 °C
Thermal resistance junction/
ambient
R
thJA
400 K/W