Datasheet

Molded Guide
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Vishay Polytech
Revision: 11-Apr-16
6
Document Number: 40218
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard
PROFILE FEATURE LEAD (Pb)-FREE ASSEMBLY
Preheat / soak
Temperature min. (T
s min.
) 130 °C
Temperature max. (T
s max.
) 160 °C
Time (t
s
) from (T
s min.
to T
s max.
) 60 s to 120 s
Ramp-up
Ramp-up rate (T
L
to T
p
) 3 °C/s max.
Liquidus temperature (T
L
) 200 °C
Time (t
L
) maintained above T
L
50 s max.
Peak package body temperature (T
p
) max. Depends on case size - see table below
Time (t
p
) within 5 °C of the peak maximum temperature 10 s max.
Ramp-down rate (T
p
to T
L
) 6 °C/s max.
Time from 25 °C to peak temperature 8 min max.
PEAK PACKAGE BODY TEMPERATURE (T
p
)
CASE CODE
PEAK PACKAGE BODY TEMPERATURE (T
p
)
LEAD (Pb)-FREE PROCESS
J, P, UA, A, UB, B, C 260 °C
E, F 250 °C
PAD DIMENSIONS in millimeters
CASE /
DIMENSIONS
CAPACITOR SIZE PAD DIMENSIONS
L W G (max.) Z (min.) X (min.) Y (Ref.)
J 1.6 0.8 0.7 2.5 1.0 0.9
P 2.0 1.25 0.5 2.6 1.2 1.05
UA, A 3.2 1.6 1.1 3.8 1.5 1.35
UB, B 3.5 2.8 1.4 4.1 2.7 1.35
C 5.8 3.2 2.9 6.9 2.7 2.0
E 7.3 4.3 4.1 8.2 2.9 2.05
F 7.3 5.8 4.1 8.2 4.0 2.05
25
TEMPERATURE (°C)
TIME (s)
t
s
t
L
Time 25 °C to peak
T
L
T
p
T
C
- 5 °C
t
p
T
s max.
T
s min.
Preheat area
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
Capacitor
Pattern
L
Y
Z
G
XW