Instruction Manual

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VISHAY

TSOP62..

Document Number 82177

Rev. 3, 23-Jun-03

Vishay Semiconductors

www.vishay.com

16797

IR Receiver Modules for Remote Control Systems

Description

The TSOP62.. - series are miniaturized SMD-IR

Receiver Modules for infrared remote control sys-

tems. PIN diode and preamplifier are assembled on

lead frame, the epoxy package is designed as IR fil-

ter.

The demodulated output signal can directly be

decoded by a microprocessor. TSOP62.. is the stan-

dard IR remote control SMD-Receiver series, sup-

porting all major transmission codes.

Features

• Photo detector and preamplifier in one package

• Internal filter for PCM frequency

• Continuous data transmission possible

• TTL and CMOS compatibility

• Output active low

• Low power consumption

• High immunity against ambient light

• Low power consumption

Special Features

• Improved immunity against ambient light

• Suitable burst length ≥ 10 cycles/burst

• Taping available for Topview and Sideview

assembly

Mechanical Data

Pinning:

1 = GND, 2 = GND, 3 = V

, 4 = OUT

Parts Table

Block Diagram

Application Circuit

Part Carrier Frequency

TSOP6230 30 kHz

TSOP6233 33 kHz

TSOP6236 36 kHz

TSOP6237 36.7 kHz

TSOP6238 38 kHz

TSOP6240 40 kHz

TSOP6256 56 kHz

30 kΩ

OUT

Demo-

GND

Pass

AGCInput

Band

dulator

Control

Circuit

1;2

16839

4.7 µF

TSOPxxxx

OUT

GND

Circuit

µC

=100Ω

GND

Transmitter

with

TSALxxxx

recommended to suppress power supply

disturbances.

The output voltage should not be hold continuously at

a voltage below V

3.3 V by the external circuit.

16842

Summary of content (14 pages)

PAGE 1
TSOP62.. VISHAY Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP62.. - series are miniaturized SMD-IR Receiver Modules for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter. The demodulated output signal can directly be decoded by a microprocessor. TSOP62.. is the standard IR remote control SMD-Receiver series, supporting all major transmission codes.
PAGE 2
TSOP62.. VISHAY Vishay Semiconductors Absolute Maximum Ratings Tamb = 25 °C, unless otherwise specified Symbol Value Supply Voltage Parameter Pin 3 Test condition VS - 0.3 to 6.0 V Supply Current Pin 3 IS 5 mA Output Voltage Pin 4 VO - 0.3 to 6.
PAGE 3
TSOP62.. VISHAY Vishay Semiconductors Typical Characteristics (Tamb = 25 °C unless otherwise specified) Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms) t tpi * T * tpi w 10/fo is recommended for optimal function VO 16110 Output Signal 1) 2) VOH 7/f0 < td < 15/f0 tpi–5/f0 < tpo < tpi+6/f0 VOL tpo2 ) td1 ) Ton ,Toff – Output Pulse Width ( ms ) Ee t 1.0 0.9 0.8 0.6 0.5 0.3 0.1 0.0 0.1 16909 1.0 10.0 100.0 1000.010000.0 Ee – Irradiance ( mW/m2 ) Figure 4.
PAGE 4
TSOP62.. VISHAY 2.0 f = fo 1.5 f = 10 kHz 1.0 f = 1 kHz 0.5 f = 100 Hz 0.0 0.1 1.0 10.0 100.0 0.4 0.3 0.2 0.1 0.0 –30 –15 1.2 0.8 0.4 0.0 0.0 0.4 0.8 1.2 E – Field Strength of Disturbance ( kV/m ) 94 8147 Figure 8. Sensitivity vs. Electric Field Disturbances 30 45 60 75 90 1.2 1.0 0.8 0.6 0.4 0.2 0.0 750 2.0 1.6 15 Figure 10. Sensitivity vs. Ambient Temperature S ( l ) rel – Relative Spectral Sensitivity E e min– Threshold Irradiance ( mW/m 2 ) f(E) = f0 1.
PAGE 5
TSOP62.. VISHAY Vishay Semiconductors Document Number 82177 Rev. 3, 23-Jun-03 IR Signal from fluorescent lamp with low modulation 0 5 10 15 20 Time ( ms ) 16920 Figure 13. IR Signal from Fluorescent Lamp with low Modulation IR Signal from fluorescent lamp with high modulation IR Signal The circuit of the TSOP62.. is designed in that way that unexpected output pulses due to noise or disturbance signals are avoided.
PAGE 6
TSOP62.. VISHAY Vishay Semiconductors Package Dimensions in mm 16629 Assembly Instructions Reflow Soldering • Reflow soldering must be done within 72 hours stored under max. 30 °C, 60 % RH after opening envelop www.vishay.com 6 • Recommended soldering paste (composition: SN 63 %, Pb 37 %) Melting temperature 178 °C to 192 °C • Apply solder paste to the specified soldering pads, by using a dispenser or by screen printing. Document Number 82177 Rev.
PAGE 7
TSOP62.. VISHAY Vishay Semiconductors Document Number 82177 Rev. 3, 23-Jun-03 Reflow Solder Profile Temperature ( q C ) • Recommended thickness of metal mask is 0.2 mm for screen printing. • The recommended reflow furnace is a combinationtype with upper and lower heaters. • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown below. Excercise extreme care to keep the maximum temperature below 230 °C.
PAGE 8
TSOP62.. VISHAY Vishay Semiconductors Taping Version TSOP..TT 16584 www.vishay.com 8 Document Number 82177 Rev.
PAGE 9
TSOP62.. VISHAY Vishay Semiconductors Taping Version TSOP..TR 16585 Document Number 82177 Rev. 3, 23-Jun-03 www.vishay.
PAGE 10
TSOP62.. VISHAY Vishay Semiconductors Reel Dimensions 16734 www.vishay.com 10 Document Number 82177 Rev.
PAGE 11
TSOP62.. VISHAY Vishay Semiconductors Leader and Trailer Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 Cover Tape Peel Strength According to DIN EN 60286-3 0.1 to 1.3 N 300 ± 10 mm/min 165 ° - 180 ° peel angle Label Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area.
PAGE 12
TSOP62..
PAGE 13
TSOP62.. VISHAY Vishay Semiconductors Recommended Method of Storage Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 72 hours under these conditions moisture content will be too high for reflow soldering.
PAGE 14
TSOP62.. VISHAY Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.