Datasheet

ManualsBrandsVishay ManualsDiodesZener Diode 500mW 5.6V 100nA SOD-80

VISHAY

TZM-Series

Document Number 84122

Rev. 1.3, 19-Apr-04

Vishay Semiconductors

www.vishay.com

17205

Silicon Epitaxial Planar Zener-Diodes

Features

• Very sharp reverse characteristic

• Low reverse current level

• Very high stability

•Low noise

• TZMC - V

-tolerance ± 5 %

• TZMB - V

-tolerance ± 2 %

• Available with tighter tolerances

Applications

Voltage stabilization

Mechanical Data

Case: MiniMELF Glass Case (SOD-80)

Weight: approx. 31 mg

Packaging codes/ options:

GS08/ 2.5 k per 7" reel (8 mm tape), 12.5 k/box

GS18/ 10 k per 13" reel (8 mm tape), 10 k/box

Absolute Maximum Ratings

amb

= 25 °C, unless otherwise specified

Thermal Characteristics

amb

= 25 °C, unless otherwise specified

Electrical Characteristics

amb

= 25 °C, unless otherwise specified

Parameter Test condition Symbol Value Unit

Power dissipation R

thJA

≤ 300 K/W P

tot

500 mW

Z-current I

tot

Junction temperature T

175 °C

Storage temperature range T

stg

- 65 to + 175 °C

Parameter Test condition Symbol Value Unit

Junction ambient on PC board 50 mm x 50 mm x 1.6 mm R

thJA

500 K/W

Parameter Test condition Symbol Min Typ. Max Unit

Forward voltage I

= 200 mA V

1.5 V

Summary of content (7 pages)

PAGE 1
TZM-Series VISHAY Vishay Semiconductors Silicon Epitaxial Planar Zener-Diodes Features • • • • • • • Very sharp reverse characteristic Low reverse current level Very high stability Low noise TZMC - VZ-tolerance ± 5 % TZMB - VZ-tolerance ± 2 % Available with tighter tolerances 17205 Applications Voltage stabilization Mechanical Data Case: MiniMELF Glass Case (SOD-80) Weight: approx. 31 mg Packaging codes/ options: GS08/ 2.5 k per 7" reel (8 mm tape), 12.
PAGE 2
TZM-Series VISHAY Vishay Semiconductors Electrical Characteristics Partnumber Zener Voltage Range VZ @ IZT 1) rzjT @ IZT Test Current Reverse Leakage Current rzjK @ IZK IZT IZK IR IR1) @ VR mA mA µA µA V V V Ω Ω min max typ typ TZMC2V4 2.28 2.56 < 85 < 600 5 1 < 50 < 100 TZMC2V7 2.5 2.9 < 85 < 600 5 1 < 10 < 50 TZMC3V0 2.8 3.2 < 90 < 600 5 1 <4 TZMC3V3 3.1 3.5 < 90 < 600 5 1 TZMC3V6 3.4 3.8 < 90 < 600 5 1 TZMC3V9 3.7 4.
PAGE 3
TZM-Series VISHAY Vishay Semiconductors Electrical Characteristics Partnumber Zener Voltage Range VZ @ IZT 1) Dynamic Resistance rzjT @ IZT Test Current Reverse Leakage Current rzjK @ IZK IZT IZK IR IR1) @ VR mA mA µA µA V Temperature Coefficient of Zener Voltage TKVZ V V Ω Ω min max typ typ TZMB2V4 2.35 2.45 < 85 < 600 5 1 < 50 < 100 1 -0.09 -0.06 TZMB2V7 2.64 2.76 < 85 < 600 5 1 < 10 < 50 1 -0.09 -0.06 TZMB3V0 2.94 3.
PAGE 4
TZM-Series VISHAY Vishay Semiconductors 600 500 400 300 200 100 0 0 40 80 120 160 200 Tamb – Ambient Temperature(°C ) 95 9602 TK VZ –Temperature Coefficient of VZ ( 10–4 /K) Ptot –Total Power Dissipation ( mW) Typical Characteristics (Tamb = 25 °C unless otherwise specified) 10 5 I Z=5mA 0 –5 0 30 40 50 CD – Diode Capacitance ( pF ) 200 Tj =25°C 100 I Z=5mA 10 150 V R=2V Tj =25°C 100 50 1 0 0 5 10 15 20 25 V Z – Z-Voltage ( V ) 95 9598 0 5 10 15 20 25 V Z – Z-Volta
PAGE 5
TZM-Series VISHAY Vishay Semiconductors IZ – Z-Current ( mA) 80 r Z – Differential Z-Resistance ( Ω ) 100 Ptot=500mW Tamb=25°C 60 40 20 1000 I Z=1mA 100 0 5mA 10 10mA Tj =25°C 1 0 4 8 12 16 20 0 V Z – Z-Voltage ( V ) 95 9604 5 10 15 20 25 V Z – Z-Voltage ( V ) 95 9606 Fig. 9 Differential Z-Resistance vs. Z-Voltage Fig. 7 Z-Current vs.
PAGE 6
TZM-Series VISHAY Vishay Semiconductors Package Dimensions in mm (Inches) 1.5 ± 0.1 (0.06 ± 0.004) Cathode indification 3.5 ± 0.2 (0.14 ± 0.008) 0.47 max. (0.02) Mounting Pad Layout 2.50 (0.098) max Glass case Mini Melf / SOD 80 JEDEC DO 213 AA 96 12070 www.vishay.com 6 2 (0.079) min 1.25 (0.049) min ISO Method E 5 (0.197) ref Document Number 84122 Rev. 1.
PAGE 7
TZM-Series VISHAY Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.