Datasheet

VDMR10A1, VDMO10A1, VDMY10A1, VDMG10A1
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 29-Nov-13
7
Document Number: 84197
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BAR CODE PRODUCT LABEL (example only)
A) 2D barcode
B) Vishay part number
C) Quantity
D) PTC = selection code (binning)
E) Code of manufacturing plant
F) Batch = date code: year/week/plant code
G) Region code
H) SL = sales location
I) Terminations finishing
K) Lead (Pb)-free symbol
L) Halogen-free symbol
M) RoHS symbol
SOLDERING PROFILE
Fig. 6 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
RECOMMENDED SOLDER PAD
MSL LABEL
SOLDERING IRON (one time only)
Temperature 300 °C max.
Soldering time 3 s max.
A
B
D
C
E FG HI M
L
K
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
255
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
255 °C
19470-5
IR Reflow Soldering Profile for lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 3
max. 2 cycles allowed
3
1.65
4 x 1.9 = 7.6
15